A method includes coating a conductive wire with a paste comprising a first inorganic dielectric material, an organic binder, and a solvent to form a coated wire, drying the coated wire at a first drying temperature to remove at least a portion of the solvent and form a green wire, winding the green wire around a core to form a green assembly, heat treating the green assembly at a decomposing temperature above the first temperature and below a melting point of the first inorganic dielectric material to decompose the organic binder to form an intermediate assembly, and exposing the intermediate assembly to a densifying temperature that is above the decomposing temperature and substantially equal to or above the melting point of the first inorganic dielectric material to densify the dielectric material on the conductive wire.