Invention Grant
- Patent Title: Method for forming a touch sensing pattern and signal wires
- Patent Title (中): 用于形成触摸感测图案和信号线的方法
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Application No.: US12947826Application Date: 2010-11-17
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Publication No.: US08486284B2Publication Date: 2013-07-16
- Inventor: Kai-Ti Yang , Chih-Cheng Chang , Chih-Yung Liu , Chen-Ning Yang
- Applicant: Kai-Ti Yang , Chih-Cheng Chang , Chih-Yung Liu , Chen-Ning Yang
- Main IPC: H01B13/00
- IPC: H01B13/00

Abstract:
A method for forming a touch sensing pattern and signal wires, comprises the steps of: installing a first and a second conductive plating films on a surface of a highly transparency substrate; projecting a high energy light beam to the conductive plating films; and the high energy light beam moving with respect to the substrate along a predetermined track; a plurality of insulating trenches being formed in the first and second conductive plating films so as to form predetermined patterns for a sensing area and a wire area; a yellow light process being performed on the substrate; a layer of light resistor thin film being formed on a surfaces of the wire area; and etching the first conductive plating film in the sensing area; by above steps, the predetermined pattern in the sensing area being formed in the second conductive plating film.
Public/Granted literature
- US20120118851A1 METHOD FOR FORMING A TOUCH SENSING PATTERN AND SIGNAL WIRES Public/Granted day:2012-05-17
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