发明授权
- 专利标题: Method for forming self-aligned contact
- 专利标题(中): 形成自对准接触的方法
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申请号: US13093742申请日: 2011-04-25
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公开(公告)号: US08487397B2公开(公告)日: 2013-07-16
- 发明人: Jar-Ming Ho , Yi-Nan Chen , Hsien-Wen Liu
- 申请人: Jar-Ming Ho , Yi-Nan Chen , Hsien-Wen Liu
- 申请人地址: TW Taoyuan
- 专利权人: Nanya Technology Corporation
- 当前专利权人: Nanya Technology Corporation
- 当前专利权人地址: TW Taoyuan
- 主分类号: H01L23/52
- IPC分类号: H01L23/52
摘要:
An integrated circuit with a self-aligned contact includes a substrate with a transistor formed thereover, a dielectric spacer, a protection barrier, and a conductive layer. The transistor includes a mask layer and a pair of insulating spacers formed on opposite sides of the mask layer. The dielectric spacer partially covers at least one of the insulating spacers of the transistor. The protection barrier is formed over the dielectric spacer. The conductive layer is formed over the mask layer, the protection barrier, the dielectric spacer, the insulating spacer and the dielectric spacer as a self-aligned contact for contacting a source/drain region of the transistor.
公开/授权文献
- US20120267727A1 METHOD FOR FORMING SELF-ALIGNED CONTACT 公开/授权日:2012-10-25
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