发明授权
- 专利标题： Semiconductor structure, manufacturing method of semiconductor structure and semiconductor device
- 专利标题（中）： 半导体结构，半导体结构和半导体器件的制造方法
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申请号： US13074233申请日： 2011-03-29
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公开(公告)号： US08487443B2公开(公告)日： 2013-07-16
- 发明人: Shinji Wakisaka
- 申请人： Shinji Wakisaka
- 申请人地址： JP Tokyo
- 专利权人： Teramikros, Inc.
- 当前专利权人： Teramikros, Inc.
- 当前专利权人地址： JP Tokyo
- 代理机构： Holtz, Holtz, Goodman & Chick, PC
- 优先权： JP2010-075037 20100329
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
Disclosed is a semiconductor structure including a semiconductor substrate including an electronic circuit which is provided in a predetermined region of the semiconductor substrate, a wiring provided on the semiconductor substrate in a region outside of the predetermined region, an external connection electrode provided on the wiring, a sealing resin which covers a side surface of the external connection electrode and a wall which intervenes between the electronic circuit and the sealing resin.
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