发明授权
- 专利标题: Semiconductor laser element and manufacturing method thereof
- 专利标题(中): 半导体激光元件及其制造方法
-
申请号: US13133946申请日: 2009-12-10
-
公开(公告)号: US08488644B2公开(公告)日: 2013-07-16
- 发明人: Suguru Imai , Keishi Takaki , Norihiro Iwai , Kinuka Tanabe , Hitoshi Shimizu , Hirotatsu Ishii
- 申请人: Suguru Imai , Keishi Takaki , Norihiro Iwai , Kinuka Tanabe , Hitoshi Shimizu , Hirotatsu Ishii
- 申请人地址: JP Tokyo
- 专利权人: Furukawa Electric Co., Ltd.
- 当前专利权人: Furukawa Electric Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: SOLARIS Intellectual Property Group, PLLC
- 优先权: JP2008-314530 20081210
- 国际申请: PCT/JP2009/070693 WO 20091210
- 国际公布: WO2010/067845 WO 20100617
- 主分类号: H01S5/00
- IPC分类号: H01S5/00
摘要:
A semiconductor laser element includes a first electrode, a second electrode, a first reflecting mirror, a second reflecting mirror, and a resonator. The resonator includes an active layer, a current confinement layer, a first semiconductor layer having a first doping concentration formed at a side opposite to the active layer across the current confinement layer, and a second semiconductor layer having a second doping concentration higher than the first doping concentration formed between the first semiconductor layer and the current confinement layer. The first electrode is provided to contact a part of a surface of the first semiconductor layer. The first semiconductor layer has a diffusion portion into which a component of the first electrode diffuses. The second semiconductor layer contacts the diffusion portion. The second semiconductor layer is positioned at a node of a standing wave at a time of laser oscillation of the semiconductor laser element.
公开/授权文献
信息查询