Invention Grant
- Patent Title: Automatic winding of wire field in wire slicing machine
- Patent Title (中): 线切割机自动上线
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Application No.: US12710668Application Date: 2010-02-23
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Publication No.: US08490658B2Publication Date: 2013-07-23
- Inventor: Lukasz A. Glinski , Debabrata Ghosh
- Applicant: Lukasz A. Glinski , Debabrata Ghosh
- Applicant Address: US MA Worcester FR Conflans-Sainte-Honorine
- Assignee: Saint-Gobain Abrasives, Inc.,Saint-Gobain Abrasifs
- Current Assignee: Saint-Gobain Abrasives, Inc.,Saint-Gobain Abrasifs
- Current Assignee Address: US MA Worcester FR Conflans-Sainte-Honorine
- Agency: Abel Law Group, LLP
- Agent Joseph P. Sullivan
- Main IPC: B21F3/00
- IPC: B21F3/00 ; B65H81/06
Abstract:
Automatic winding of a wire field in a wire slicing machine is disclosed. In one embodiment, a wire field is automatically generated in a wire slicing machine by unloading wire from at least one wire spool and winding the wire about one or more wire guides to form the wire field.
Public/Granted literature
- US20100218842A1 AUTOMATIC WINDING OF WIRE FIELD IN WIRE SLICING MACHINE Public/Granted day:2010-09-02
Information query
