发明授权
US08490857B2 Reflow apparatus, a reflow method, and a manufacturing method of a semiconductor device
有权
回流装置，回流方法以及半导体装置的制造方法
- 专利标题： Reflow apparatus, a reflow method, and a manufacturing method of a semiconductor device
- 专利标题（中）： 回流装置，回流方法以及半导体装置的制造方法
-
申请号： US13436843申请日： 2012-03-31
-
公开(公告)号： US08490857B2公开(公告)日： 2013-07-23
- 发明人: Hiroyuki Matsui , Hirohisa Matsuki , Koki Otake
- 申请人： Hiroyuki Matsui , Hirohisa Matsuki , Koki Otake
- 申请人地址： JP Yokohama
- 专利权人： Fujitsu Semiconductor Limited
- 当前专利权人： Fujitsu Semiconductor Limited
- 当前专利权人地址： JP Yokohama
- 代理机构： Fujitsu Patent Center
- 优先权： JP2005-319819 20051102
- 主分类号： B23K1/00
- IPC分类号： B23K1/00 ; H01L21/44
摘要：
A reflow apparatus, where formic acid is used for cleaning a surface of a solder electrode on a processing target, is disclosed. The reflow apparatus includes a processing chamber, a formic acid introduction mechanism for supplying an atmosphere gas containing formic acid to the processing chamber, and a shielding member that is made of a material having corrosion resistance against formic acid. The shielding member is arranged between a reflow processing section of the processing chamber and an inner wall of the processing chamber. In place of or in addition to the shielding member, the reflow apparatus may include a heater for decomposing residual formic acid.
公开/授权文献
信息查询
IPC分类:
