Invention Grant
- Patent Title: Underfill method and chip package
- Patent Title (中): 底部填充法和芯片封装
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Application No.: US13358910Application Date: 2012-01-26
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Publication No.: US08492910B2Publication Date: 2013-07-23
- Inventor: Michael A. Gaynes , Rajneesh Kumar , Thomas E. Lombardi , Steve Ostrander
- Applicant: Michael A. Gaynes , Rajneesh Kumar , Thomas E. Lombardi , Steve Ostrander
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Matthew Zehrer
- Main IPC: H01L23/28
- IPC: H01L23/28
Abstract:
A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a first underfill in a space defined between opposing faces of the chip and the laminate and dispensing a second underfill at least at a portion of an edge of the chip, the second underfill including a high aspect ratio material.
Public/Granted literature
- US20120119353A1 UNDERFILL METHOD AND CHIP PACKAGE Public/Granted day:2012-05-17
Information query
IPC分类:
