发明授权
- 专利标题： Stacked interconnect heat sink
- 专利标题（中）： 堆叠互连散热器
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申请号： US12840016申请日： 2010-07-20
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公开(公告)号： US08492911B2公开(公告)日： 2013-07-23
- 发明人: Mark A. Bachman , John W. Osenbach , Sailesh M. Merchant
- 申请人： Mark A. Bachman , John W. Osenbach , Sailesh M. Merchant
- 申请人地址： US CA Milpitas
- 专利权人： LSI Corporation
- 当前专利权人： LSI Corporation
- 当前专利权人地址： US CA Milpitas
- 代理机构： Hitt Gaines PC
- 主分类号： H01L23/28
- IPC分类号： H01L23/28
摘要：
An electronic device includes an integrated circuit and a heat spreader. The integrated circuit includes a substrate with an active via located therein. The heat spreader includes a thermally conductive core. The active via is connected to a corresponding heat spreader via that passes through the thermally conductive core.
公开/授权文献
- US20120020028A1 STACKED INTERCONNECT HEAT SINK 公开/授权日：2012-01-26
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