发明授权
- 专利标题： Packaging system with hollow package and method for the same
- 专利标题（中）： 包装系统采用中空包装和方法相同
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申请号： US11769520申请日： 2007-06-27
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公开(公告)号： US08493748B2公开(公告)日： 2013-07-23
- 发明人: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Lionel Chien Hui Tay , Jeffrey D. Punzalan
- 申请人： Zigmund Ramirez Camacho , Henry Descalzo Bathan , Lionel Chien Hui Tay , Jeffrey D. Punzalan
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 代理商 I-Chang John Yang
- 主分类号： H05K5/02
- IPC分类号： H05K5/02 ; H05K7/18
摘要：
A packaging system comprising: forming terminal leads; configuring a cavity by partially encapsulating the terminal leads with a compound; attaching an integrated circuit device, a micro-electromechanical system, a micro-mechanical system, or a combination thereof in the cavity; and bonding a cover to the terminal leads for enclosing the cavity.
公开/授权文献
- US20090002961A1 PACKAGING SYSTEM WITH HOLLOW PACKAGE 公开/授权日：2009-01-01
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