发明授权
- 专利标题: Grounding structures for header and receptacle assemblies
- 专利标题(中): 接头和插座组件的接地结构
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申请号: US13296852申请日: 2011-11-15
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公开(公告)号: US08500487B2公开(公告)日: 2013-08-06
- 发明人: Chad William Morgan , Timothy Robert Minnick , Dharmendra Saraswat , Nathan William Swanger , Charles S. Pickles , Justin Shane McClellan , Lynn Robert Sipe , James Lee Fedder
- 申请人: Chad William Morgan , Timothy Robert Minnick , Dharmendra Saraswat , Nathan William Swanger , Charles S. Pickles , Justin Shane McClellan , Lynn Robert Sipe , James Lee Fedder
- 申请人地址: US PA Berwyn
- 专利权人: Tyco Electronics Corporation
- 当前专利权人: Tyco Electronics Corporation
- 当前专利权人地址: US PA Berwyn
- 主分类号: H01R13/648
- IPC分类号: H01R13/648
摘要:
A receptacle assembly includes a front housing configured for mating with a header assembly and a contact module coupled to the front housing. The contact module includes a conductive holder having a first side wall and an opposite second side wall. The conductive holder has a chamber between the first and second side walls. The conductive holder has a front coupled to the front housing. The contact module includes a frame assembly that is received in the chamber. The frame assembly includes a plurality of contacts and a dielectric frame that supports the contacts. The contacts extend from the conductive holder for electrical termination. A plurality of ground clips are received in the chamber and extend from the front of the conductive holder. The ground clips are mechanically and electrically connected to the conductive holder.
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