Invention Grant
- Patent Title: Method and system for mask handling in high productivity chamber
- Patent Title (中): 高生产率室中面罩处理方法和系统
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Application No.: US13656118Application Date: 2012-10-19
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Publication No.: US08500908B2Publication Date: 2013-08-06
- Inventor: Rick Endo , James Tsung , Kurt H Weiner
- Applicant: Intermolecular, Inc.
- Applicant Address: US CA San Jose
- Assignee: Intermolecular, Inc.
- Current Assignee: Intermolecular, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: C23C16/04
- IPC: C23C16/04

Abstract:
A structure for independently supporting a wafer and a mask in a processing chamber is provided. The structure includes a set of extensions for supporting the wafer and a set of extensions supporting the mask. The set of extensions for the wafer and the set of extensions for the mask enable independent movement of the wafer and the mask. In one embodiment, the extensions are affixed to an annular ring which is capable of moving in a vertical direction within the processing chamber. A processing chamber, a mask, and a method for combinatorially processing a substrate are also provided.
Public/Granted literature
- US20130042810A1 Method and System for Mask Handling in High Productivity Chamber Public/Granted day:2013-02-21
Information query
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