发明授权
US08502227B2 Active matrix substrate, display device, method for inspecting the active matrix substrate, and method for inspecting the display device
有权
有源矩阵基板,显示装置,有源矩阵基板的检查方法以及检查显示装置的方法
- 专利标题: Active matrix substrate, display device, method for inspecting the active matrix substrate, and method for inspecting the display device
- 专利标题(中): 有源矩阵基板,显示装置,有源矩阵基板的检查方法以及检查显示装置的方法
-
申请号: US13055029申请日: 2009-05-11
-
公开(公告)号: US08502227B2公开(公告)日: 2013-08-06
- 发明人: Masahiro Yoshida , Takehiko Kawamura , Katsuhiro Okada
- 申请人: Masahiro Yoshida , Takehiko Kawamura , Katsuhiro Okada
- 申请人地址: JP Osaka-shi, Osaka
- 专利权人: Sharp Kabushiki Kaisha
- 当前专利权人: Sharp Kabushiki Kaisha
- 当前专利权人地址: JP Osaka-shi, Osaka
- 代理机构: Nixon & Vanderhye, P.C.
- 优先权: JP2008-190148 20080723
- 国际申请: PCT/JP2009/058777 WO 20090511
- 国际公布: WO2010/010750 WO 20100128
- 主分类号: H01L29/04
- IPC分类号: H01L29/04
摘要:
An active matrix substrate (2) is provided with first connecting wirings (641, 643, 645, 647) connected to gate terminals (51) to which extraction wirings (611, 613, 615, 617) are connected, second connecting wirings (642, 644, 646) connected to gate terminals (51) to which extraction wirings (612, 614, 616) are connected, bundled wirings (651 to 654) each composed of a mutually adjacent first connecting wiring and second connecting wiring bunched together, a first inspection wiring (66) capable of inputting an inspection signal to bunched wirings (652, 654) that are not adjacent to each other among the bundled wirings, and a second inspection wiring (67) capable of inputting an inspection signal to bundled wirings (651, 653) that are not adjacent to each other and not connected to the first inspection wiring (66) among the bundled wirings.
公开/授权文献
信息查询
IPC分类: