Invention Grant
- Patent Title: Power module package and method for manufacturing the same
- Patent Title (中): 电源模块封装及其制造方法
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Application No.: US13281285Application Date: 2011-10-25
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Publication No.: US08502374B2Publication Date: 2013-08-06
- Inventor: Kwang Soo Kim , Young Ki Lee , Sung Keun Park , Seog Moon Choi , Chang Hyun Lim
- Applicant: Kwang Soo Kim , Young Ki Lee , Sung Keun Park , Seog Moon Choi , Chang Hyun Lim
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Priority: KR10-2011-0065996 20110704
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate having grooves formed between a plurality of semiconductor device mounting areas; semiconductor devices mounted on the semiconductor device mounting areas of the base substrate; and a molding formed on the base substrate and in inner portions of the grooves.
Public/Granted literature
- US20130009291A1 POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-01-10
Information query
IPC分类:
