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公开(公告)号：US08502374B2
公开(公告)日：2013-08-06
申请号：US13281285
申请日：2011-10-25
申请人： Kwang Soo Kim , Young Ki Lee , Sung Keun Park , Seog Moon Choi , Chang Hyun Lim
发明人： Kwang Soo Kim , Young Ki Lee , Sung Keun Park , Seog Moon Choi , Chang Hyun Lim
IPC分类号： H01L23/34
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/3142 , H01L23/4334 , H01L23/49531 , H01L24/48 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate having grooves formed between a plurality of semiconductor device mounting areas; semiconductor devices mounted on the semiconductor device mounting areas of the base substrate; and a molding formed on the base substrate and in inner portions of the grooves.
摘要翻译： 这里公开了功率模块封装及其制造方法。 功率模块封装包括：具有形成在多个半导体器件安装区域之间的沟槽的基底基板; 安装在基底基板的半导体器件安装区域上的半导体器件; 以及形成在基底基板上和凹槽的内部中的模制件。
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公开(公告)号：US20110304990A1
公开(公告)日：2011-12-15
申请号：US12884058
申请日：2010-09-16
申请人： Chang Hyun Lim , Jung Eun Kang , Seog Moon Choi , Kwang Soo Kim , Sung Keun Park
发明人： Chang Hyun Lim , Jung Eun Kang , Seog Moon Choi , Kwang Soo Kim , Sung Keun Park
CPC分类号： H05K1/0203 , H05K1/053 , H05K1/141 , H05K2201/062 , H05K2201/09745 , H05K2201/10166 , Y10T29/49083 , Y10T29/49124 , Y10T29/49155 , Y10T156/10 , Y10T156/1056 , Y10T156/1064
摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space.
摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括：芯层，其包括芯金属层和形成在芯金属层上的芯绝缘层，并分为第一区域和第二区域; 形成在芯层的第一区域中的电路层; 形成在所述芯层的所述第二区域中的堆积层，并且包括积聚绝缘层和积聚电路层; 形成在芯层的第二区域和积层之间的粘合层; 以及安装在堆积层上以浸渍到粘合剂层中的浸渍装置。 发热元件安装在电路层上，并且热增强元件安装在积层上，从而防止热弱化元件被发热元件的热量损坏。 浸渍装置形成在堆积层上并浸渍在粘合剂层中，从而有效地利用空间。
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公开(公告)号：US08315056B2
公开(公告)日：2012-11-20
申请号：US12884058
申请日：2010-09-16
申请人： Chang Hyun Lim , Jung Eun Kang , Seog Moon Choi , Kwang Soo Kim , Sung Keun Park
发明人： Chang Hyun Lim , Jung Eun Kang , Seog Moon Choi , Kwang Soo Kim , Sung Keun Park
CPC分类号： H05K1/0203 , H05K1/053 , H05K1/141 , H05K2201/062 , H05K2201/09745 , H05K2201/10166 , Y10T29/49083 , Y10T29/49124 , Y10T29/49155 , Y10T156/10 , Y10T156/1056 , Y10T156/1064
摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space.
摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括：芯层，其包括芯金属层和形成在芯金属层上的芯绝缘层，并分为第一区域和第二区域; 形成在芯层的第一区域中的电路层; 形成在所述芯层的所述第二区域中的堆积层，并且包括积聚绝缘层和积聚电路层; 形成在芯层的第二区域和积层之间的粘合层; 以及安装在堆积层上以浸渍到粘合剂层中的浸渍装置。 发热元件安装在电路层上，并且热增强元件安装在积层上，从而防止热弱化元件被发热元件的热量损坏。 浸渍装置形成在堆积层上并浸渍在粘合剂层中，从而有效地利用空间。
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公开(公告)号：US20120000697A1
公开(公告)日：2012-01-05
申请号：US12954416
申请日：2010-11-24
申请人： Jung Eun Kang , Seog Moon Choi , Sung Keun Park , Chang Hyun Lim , Kwang Soo Kim
发明人： Jung Eun Kang , Seog Moon Choi , Sung Keun Park , Chang Hyun Lim , Kwang Soo Kim
CPC分类号： H05K1/053 , H01L23/13 , H01L23/142 , H01L23/498 , H01L2224/73265 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H05K3/107 , H05K3/108 , H05K2201/10166 , H05K2203/0315 , H05K2203/0369 , H01L2924/00 , H01L2924/00014
摘要： Disclosed herein is a printed circuit board, including: a substrate having a cavity formed therein; an anodic oxide layer formed by anodizing the substrate; and a circuit layer formed in the cavity. The printed circuit board is advantageous in that, since a circuit layer is formed in a cavity of a substrate, a circuit layer having a thickness necessary for realizing a high-power semiconductor package can be easily formed, and the difficulty of supplying and demanding the raw material of a thick film plating resist can be overcome. Further, the printed circuit board is advantageous in that electrical shorts occurring at the time of forming a thick circuit layer and electrical shorts generated by the compounds remaining after etching can be prevented, thus improving the electrical reliability and stability of a circuit layer.
摘要翻译： 本文公开了一种印刷电路板，包括：其中形成有腔的基板; 通过阳极氧化所述基板形成的阳极氧化层; 以及形成在空腔中的电路层。 印刷电路板的优点在于，由于电路层形成在基板的空腔中，所以可以容易地形成具有实现大功率半导体封装所需的厚度的电路层，并且难以供应和要求 可以克服厚膜电镀抗蚀剂的原料。 此外，印刷电路板的优点在于，可以防止在形成厚电路层时发生的电短路和蚀刻后残留的化合物产生的电短路，从而提高电路层的电可靠性和稳定性。
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公开(公告)号：US08686295B2
公开(公告)日：2014-04-01
申请号：US12614407
申请日：2009-11-07
申请人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Young Ki Lee , Sung Keun Park
发明人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Young Ki Lee , Sung Keun Park
CPC分类号： H05K3/02 , H05K1/0201 , H05K1/053 , H05K3/0061 , H05K2201/062 , H05K2201/09881 , H05K2201/09972 , H05K2203/0315
摘要： Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.
摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括由形成在分割区域中的第一绝缘体分割的镀层。 金属板形成在镀层的上表面上，并且在对应于分割区域的位置处填充有第二绝缘体，阳极氧化层形成在金属板的表面上。 在形成在金属板的上表面上的阳极氧化层上形成电路层。 散热基板及其制造方法通过形成在分割区域和第二绝缘体中的第一绝缘体进行热隔离。
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公开(公告)号：US08941220B2
公开(公告)日：2015-01-27
申请号：US13484160
申请日：2012-05-30
申请人： Kwang Soo Kim , Young Ki Lee , Seog Moon Choi , Sung Keun Park
发明人： Kwang Soo Kim , Young Ki Lee , Seog Moon Choi , Sung Keun Park
IPC分类号： H01L23/495 , H01L23/433 , H01L23/498 , H01L23/31 , H01L23/00 , H01L25/065
CPC分类号： H01L23/4334 , H01L23/3121 , H01L23/49531 , H01L23/49575 , H01L23/49833 , H01L24/16 , H01L24/48 , H01L25/0652 , H01L25/0655 , H01L2224/16225 , H01L2224/16227 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/4847 , H01L2924/00014 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate.
摘要翻译： 本文公开了一种功率模块封装，包括：第一衬底，其上安装有第一半导体芯片; 以及具有安装在其上的第二半导体芯片的第二基板，所述第二基板与所述第一基板结合，使得其厚度方向的侧表面设置在所述第一基板的上表面上。
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公开(公告)号：US20120319260A1
公开(公告)日：2012-12-20
申请号：US13484160
申请日：2012-05-30
申请人： Kwang Soo Kim , Young Ki Lee , Seog Moon Choi , Sung Keun Park
发明人： Kwang Soo Kim , Young Ki Lee , Seog Moon Choi , Sung Keun Park
IPC分类号： H01L23/495
CPC分类号： H01L23/4334 , H01L23/3121 , H01L23/49531 , H01L23/49575 , H01L23/49833 , H01L24/16 , H01L24/48 , H01L25/0652 , H01L25/0655 , H01L2224/16225 , H01L2224/16227 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/4847 , H01L2924/00014 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate.
摘要翻译： 本文公开了一种功率模块封装，包括：第一衬底，其上安装有第一半导体芯片; 以及具有安装在其上的第二半导体芯片的第二基板，所述第二基板与所述第一基板结合，使得其厚度方向的侧表面设置在所述第一基板的上表面上。
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8.发明申请公开(公告)号：US20120225508A1
公开(公告)日：2012-09-06
申请号：US13418241
申请日：2012-03-12
申请人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Sung Keun Park , Young Ki Lee
发明人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Sung Keun Park , Young Ki Lee
IPC分类号： H01L33/48
CPC分类号： H01L33/54 , H01L33/505 , H01L33/62 , H01L2224/32225 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.
摘要翻译： 公开了一种用于光学元件的封装基板，其包括基底基板，形成在基底基板上并包括安装部分的第一电路层，安装在安装部分上的光学元件，形成为预定图案的一个或多个沟槽 通过去除第一电路层的部分使得第一电路层和光学元件彼此电连接的安装部分和施加在由沟槽限定的区域以覆盖光学元件的荧光树脂材料，以及 其中这种沟槽形成在第一电路层上，使得光学元件和第一电路层彼此电连接，从而保持荧光树脂材料的形状，并且消除了在光学元件下形成通孔的需要。 还提供了一种制造用于光学元件的封装衬底的方法。
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公开(公告)号：US08603842B2
公开(公告)日：2013-12-10
申请号：US13418241
申请日：2012-03-12
申请人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Sung Keun Park , Young Ki Lee
发明人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Sung Keun Park , Young Ki Lee
IPC分类号： H01L33/62
CPC分类号： H01L33/54 , H01L33/505 , H01L33/62 , H01L2224/32225 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.
摘要翻译： 公开了一种用于光学元件的封装基板，其包括基底基板，形成在基底基板上并包括安装部分的第一电路层，安装在安装部分上的光学元件，形成为预定图案的一个或多个沟槽 通过去除第一电路层的部分使得第一电路层和光学元件彼此电连接的安装部分和施加在由沟槽限定的区域以覆盖光学元件的荧光树脂材料，以及 其中这种沟槽形成在第一电路层上，使得光学元件和第一电路层彼此电连接，从而保持荧光树脂材料的形状，并且消除了在光学元件下形成通孔的需要。 还提供了一种制造用于光学元件的封装衬底的方法。
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10.发明申请公开(公告)号：US20110140144A1
公开(公告)日：2011-06-16
申请号：US12721539
申请日：2010-03-10
申请人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Sung Keun Park , Young Ki Lee
发明人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Sung Keun Park , Young Ki Lee
CPC分类号： H01L33/54 , H01L33/505 , H01L33/62 , H01L2224/32225 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.
摘要翻译： 公开了一种用于光学元件的封装基板，其包括基底基板，形成在基底基板上并包括安装部分的第一电路层，安装在安装部分上的光学元件，形成为预定图案的一个或多个沟槽 通过去除第一电路层的部分使得第一电路层和光学元件彼此电连接的安装部分和施加在由沟槽限定的区域以覆盖光学元件的荧光树脂材料，以及 其中这种沟槽形成在第一电路层上，使得光学元件和第一电路层彼此电连接，从而保持荧光树脂材料的形状，并且消除了在光学元件下形成通孔的需要。 还提供了一种制造用于光学元件的封装衬底的方法。
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