Invention Grant
- Patent Title: Method and device for fastening a planar substrate, having an electric circuit or the like, in a mounting position
- Patent Title (中): 将具有电路等的平面基板紧固在安装位置的方法和装置
-
Application No.: US12451807Application Date: 2008-05-07
-
Publication No.: US08505891B2Publication Date: 2013-08-13
- Inventor: Michael Guyenot , Alexander Geissler
- Applicant: Michael Guyenot , Alexander Geissler
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102007025957 20070604
- International Application: PCT/EP2008/055653 WO 20080507
- International Announcement: WO2008/148620 WO 20081211
- Main IPC: B23Q3/08
- IPC: B23Q3/08 ; H05K7/20 ; B65D25/08 ; H01L21/687
Abstract:
In a method for fastening a planar substrate having an electric circuit at a mounting position on a mounting element, a holding arrangement acts upon the planar substrate to fasten it, an activatable expansion arrangement being used as the holding arrangement.
Public/Granted literature
Information query
IPC分类:
