发明授权
US08506055B2 MEMS integrated circuit having backside integrated circuit contacts
有权
具有背面集成电路触点的MEMS集成电路
- 专利标题： MEMS integrated circuit having backside integrated circuit contacts
- 专利标题（中）： 具有背面集成电路触点的MEMS集成电路
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申请号： US13197744申请日： 2011-08-03
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公开(公告)号： US08506055B2公开(公告)日： 2013-08-13
- 发明人: Gregory John McAvoy , Rónán Pádraig Seán O'Reilly , David McLeod Johnstone , Kia Silverbrook
- 申请人： Gregory John McAvoy , Rónán Pádraig Seán O'Reilly , David McLeod Johnstone , Kia Silverbrook
- 申请人地址： IE Dublin
- 专利权人： Zamtec Ltd
- 当前专利权人： Zamtec Ltd
- 当前专利权人地址： IE Dublin
- 代理机构： Cooley LLP
- 主分类号： B41J2/14
- IPC分类号： B41J2/14 ; B41J2/16
摘要：
A MEMS integrated circuit includes a silicon substrate having a frontside with a drive circuitry layer and a backside. A MEMS layer is disposed on the drive circuitry layer. The MEMS layer includes a plurality of MEMS devices electrically connected to the drive circuitry layer. Integrated circuit contacts are positioned at a backside of the substrate. The integrated circuit contacts are electrically connected to the drive circuitry layer via respective connector rods extending through the substrate.
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