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公开(公告)号：US08287095B2
公开(公告)日：2012-10-16
申请号：US12509489
申请日：2009-07-27
CPC分类号： B41J2/1601 , B41J2/14024 , B41J2/14072 , B41J2/14145 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1635 , B41J2/1637 , B41J2/1642 , B41J2/1643 , B41J2/1645 , B41J2002/14491 , B41J2202/11 , B41J2202/18 , B41J2202/20
摘要： A printhead integrated circuit comprising a silicon substrate defining a frontside and a backside, inkjet nozzle assemblies positioned at the frontside, drive circuitry for supplying power to the inkjet nozzle assemblies and through-silicon connectors extending from the frontside towards the backside. The through-silicon connectors provides electrical connections between the drive circuitry and corresponding integrated circuit contacts. The integrated circuit contacts are positioned for connection to a backside-mounted connector film supplying power to the drive circuitry.
摘要翻译： 一种打印头集成电路，包括限定前侧和后侧的硅衬底，位于前侧的喷墨喷嘴组件，用于向喷墨喷嘴组件供电的驱动电路以及从前侧向后侧延伸的穿硅连接器。 贯通硅连接器提供驱动电路和对应的集成电路触点之间的电连接。 集成电路触点定位成连接到向驱动电路供电的背面安装的连接器膜。
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2.发明授权Method of fabricating printhead integrated circuit with backside electrical connections 有权制造背面电气连接的打印头集成电路的方法公开(公告)号：US08101438B2
公开(公告)日：2012-01-24
申请号：US12509491
申请日：2009-07-27
IPC分类号： H01L21/30
CPC分类号： B41J2/155 , B41J2202/19 , B41J2202/20
摘要： A method of fabricating a printhead integrated circuit configured for backside electrical connections. The method comprises the steps of: (a) providing a wafer comprising a plurality of partially-fabricated nozzle assemblies on a frontside of the wafer and through-silicon connectors extending from the frontside towards a backside of the wafer; (b) depositing a conductive layer on the frontside of said wafer and etching to form an actuator for each nozzle assembly and a frontside contact pad over a head of each through-silicon connector; (c) performing further MEMS processing steps to complete formation of nozzle assemblies ink supply channels through-silicon connectors; and (d) dividing the wafer into individual printhead integrated circuits. Each printhead integrated circuit thus formed is configured for backside-connection to the drive circuitry via the through-silicon connectors the contact pads.
摘要翻译： 一种制造用于背面电连接的打印头集成电路的方法。 该方法包括以下步骤：（a）提供晶片，其包括在晶片的前侧上的多个部分制造的喷嘴组件和从前侧朝向晶片的后侧延伸的穿硅连接器; （b）在所述晶片的前侧沉积导电层并进行蚀刻，以形成用于每个喷嘴组件的致动器和在每个贯穿硅连接器的头部上的前侧触点焊盘; （c）执行进一步的MEMS处理步骤以完成喷嘴组件的供墨通道硅 - 硅连接器的形成; 和（d）将晶片分成单独的打印头集成电路。 如此形成的每个打印头集成电路被配置为经由穿过硅连接器的接触焊盘将背面连接到驱动电路。
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3.发明授权Method of fabricating inkjet printhead assembly having backside electrical connections 有权制造具有背面电连接的喷墨打印头组件的方法公开(公告)号：US08323993B2
公开(公告)日：2012-12-04
申请号：US12509490
申请日：2009-07-27
CPC分类号： B41J2/14 , B41J2002/14491 , B41J2202/13 , B41J2202/18
摘要： A method of fabricating an inkjet printhead assembly having backside electrical connections. The method comprises the steps of: (a) providing printhead integrated circuits, each having a backside recessed edge portion and connectors extending through the integrated circuit, each connector having a head connected to frontside drive circuitry and a base in the recessed edge portion; (b) positioning a connection end of a connector film in the recessed edge portion; (c) connecting each film contact to the base of a corresponding connector; and (d) attaching the backside of each printhead integrated circuit together with the connector film to an ink supply manifold so as to provide the inkjet printhead assembly having backside electrical connections.
摘要翻译： 一种制造具有背面电连接的喷墨打印头组件的方法。 该方法包括以下步骤：（a）提供打印头集成电路，每个打印头集成电路具有背面凹入的边缘部分和延伸穿过集成电路的连接器，每个连接器具有连接到前侧驱动电路的头部和凹入边缘部分中的底座; （b）将连接器膜的连接端定位在凹入边缘部分中; （c）将每个胶片接触件连接到相应连接器的底座上; 和（d）将每个打印头集成电路的背面连同连接器膜连接到供墨歧管，以便提供具有背面电连接的喷墨打印头组件。
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4.发明申请METHOD OF FABRICATING INKJET PRINTHEAD ASSEMBLY HAVING BACKSIDE ELECTRICAL CONNECTIONS 有权制造具有背面电气连接的喷墨打印机组件的方法公开(公告)号：US20110020964A1
公开(公告)日：2011-01-27
申请号：US12509490
申请日：2009-07-27
IPC分类号： H01L21/30
CPC分类号： B41J2/14 , B41J2002/14491 , B41J2202/13 , B41J2202/18
摘要： A method of fabricating an inkjet printhead assembly having backside electrical connections. The method comprises the steps of: (a) providing printhead integrated circuits, each having a backside recessed edge portion and connectors extending through the integrated circuit, each connector having a head connected to frontside drive circuitry and a base in the recessed edge portion; (b) positioning a connection end of a connector film in the recessed edge portion; (c) connecting each film contact to the base of a corresponding connector; and (d) attaching the backside of each printhead integrated circuit together with the connector film to an ink supply manifold so as to provide the inkjet printhead assembly having backside electrical connections.
摘要翻译： 一种制造具有背面电连接的喷墨打印头组件的方法。 该方法包括以下步骤：（a）提供打印头集成电路，每个打印头集成电路具有背面凹入的边缘部分和延伸穿过集成电路的连接器，每个连接器具有连接到前侧驱动电路的头部和凹入边缘部分中的底座; （b）将连接器膜的连接端定位在凹入边缘部分中; （c）将每个胶片接触件连接到相应连接器的底座上; 和（d）将每个打印头集成电路的背面连同连接器膜连接到供墨歧管，以便提供具有背面电连接的喷墨打印头组件。
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5.发明授权Inkjet printhead assembly having electrical connections via connector rods extending through printhead integrated circuits 有权喷墨打印头组件具有通过打印头集成电路延伸的连接杆的电连接公开(公告)号：US08517515B2
公开(公告)日：2013-08-27
申请号：US13197751
申请日：2011-08-03
IPC分类号： B41J2/16
CPC分类号： B41J2/1601 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1639 , B41J2/1642 , B41J2/1645
摘要： An inkjet printhead assembly includes: an ink supply manifold; printhead integrated circuits attached to the ink supply manifold, each printhead integrated circuit having a frontside including drive circuitry and a plurality of inkjet nozzle assemblies disposed on the drive circuitry; and a connector film for supplying power to the drive circuitry. An integrated circuit contact positioned in a backside recessed portion of each printhead integrated circuit is connected to the connector film. The integrated circuit contact is electrically connected to the drive circuitry via a connector rod extending through the printhead integrated circuit.
摘要翻译： 喷墨打印头组件包括：供墨歧管; 连接到供墨歧管的打印头集成电路，每个打印头集成电路具有前端，包括驱动电路和设置在驱动电路上的多个喷墨喷嘴组件; 以及用于向驱动电路供电的连接器膜。 位于每个打印头集成电路的背面凹陷部分中的集成电路触点连接到连接器薄膜。 集成电路触点通过延伸穿过打印头集成电路的连接杆电连接到驱动电路。
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6.发明申请METHOD OF FABRICATING PRINTHEAD INTEGRATED CIRCUIT WITH BACKSIDE ELECTRICAL CONNECTIONS 有权用背面电气连接制造主电路集成电路的方法公开(公告)号：US20110020965A1
公开(公告)日：2011-01-27
申请号：US12509491
申请日：2009-07-27
IPC分类号： H01L21/30
CPC分类号： B41J2/155 , B41J2202/19 , B41J2202/20
摘要： A method of fabricating a printhead integrated circuit configured for backside electrical connections. The method comprises the steps of: (a) providing a wafer comprising a plurality of partially-fabricated nozzle assemblies on a frontside of the wafer and through-silicon connectors extending from the frontside towards a backside of the wafer; (b) depositing a conductive layer on the frontside of said wafer and etching to form an actuator for each nozzle assembly and a frontside contact pad over a head of each through-silicon connector; (c) performing further MEMS processing steps to complete formation of nozzle assemblies ink supply channels through-silicon connectors; and (d) dividing the wafer into individual printhead integrated circuits. Each printhead integrated circuit thus formed is configured for backside-connection to the drive circuitry via the through-silicon connectors the contact pads.
摘要翻译： 一种制造用于背面电连接的打印头集成电路的方法。 该方法包括以下步骤：（a）提供晶片，其包括在晶片的前侧上的多个部分制造的喷嘴组件和从前侧朝向晶片的后侧延伸的穿硅连接器; （b）在所述晶片的前侧沉积导电层并进行蚀刻，以形成用于每个喷嘴组件的致动器和在每个贯穿硅连接器的头部上的前侧触点焊盘; （c）执行进一步的MEMS处理步骤以完成喷嘴组件的供墨通道硅 - 硅连接器的形成; 和（d）将晶片分成单独的打印头集成电路。 如此形成的每个打印头集成电路被配置为经由穿过硅连接器的接触焊盘将背面连接到驱动电路。
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公开(公告)号：US20110018941A1
公开(公告)日：2011-01-27
申请号：US12509489
申请日：2009-07-27
IPC分类号： B41J2/14
CPC分类号： B41J2/1601 , B41J2/14024 , B41J2/14072 , B41J2/14145 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1635 , B41J2/1637 , B41J2/1642 , B41J2/1643 , B41J2/1645 , B41J2002/14491 , B41J2202/11 , B41J2202/18 , B41J2202/20
摘要： A printhead integrated circuit comprising a silicon substrate defining a frontside and a backside, inkjet nozzle assemblies positioned at the frontside, drive circuitry for supplying power to the inkjet nozzle assemblies and through-silicon connectors extending from the frontside towards the backside. The through-silicon connectors provides electrical connections between the drive circuitry and corresponding integrated circuit contacts. The integrated circuit contacts are positioned for connection to a backside-mounted connector film supplying power to the drive circuitry.
摘要翻译： 一种打印头集成电路，包括限定前侧和后侧的硅衬底，位于前侧的喷墨喷嘴组件，用于向喷墨喷嘴组件供电的驱动电路以及从前侧向后侧延伸的穿硅连接器。 贯通硅连接器提供驱动电路和对应的集成电路触点之间的电连接。 集成电路触点定位成连接到向驱动电路供电的背面安装的连接器膜。
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8.发明申请PRINTHEAD INTEGRATED CIRCUIT CONFIGURED FOR BACKSIDE ELECTRICAL CONNECTION 有权用于背面电气连接的PRINTHEAD集成电路公开(公告)号：US20110018940A1
公开(公告)日：2011-01-27
申请号：US12509488
申请日：2009-07-27
IPC分类号： B41J2/14
CPC分类号： B41J2/1601 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1639 , B41J2/1642 , B41J2/1645
摘要： A printhead integrated circuit has a frontside comprising drive circuitry and inkjet nozzle assemblies, a backside for attachment to an ink supply manifold and ink supply channels providing fluid communication between the backside and the inkjet nozzle assemblies. The backside has a recessed portion for accommodating part of a connector film, which supplies power to the drive circuitry.
摘要翻译： 打印头集成电路具有前端，其包括驱动电路和喷墨喷嘴组件，用于连接到供墨歧管的背面和用于提供背面与喷墨喷嘴组件之间的流体连通的供墨通道。 背面具有用于容纳连接器膜的一部分的凹入部分，其向驱动电路供电。
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9.发明授权MEMS integrated circuit having backside connections to drive circuitry via MEMS roof layer 有权MEMS集成电路通过MEMS屋顶层具有到驱动电路的背面连接公开(公告)号：US08544989B2
公开(公告)日：2013-10-01
申请号：US13197746
申请日：2011-08-03
CPC分类号： B41J2/1601 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1639 , B41J2/1642 , B41J2/1645
摘要： A MEMS integrated circuit includes a silicon substrate having a frontside with a drive circuitry layer and a backside. A MEMS layer is disposed on the drive circuitry layer. The MEMS layer includes a plurality of MEMS devices electrically connected to the drive circuitry layer. Connector posts extends from the drive circuitry layer to a contact pad positioned in a roof of the MEMS layer and through-silicon connectors extending linearly from the contact pad, through the drive circuitry layer and the silicon substrate, towards the backside of the silicon substrate. Each through-silicon connector terminates at a backside integrated circuit contact, such that each integrated circuit contact is electrically connected to the drive circuitry layer via the contact pad positioned in the roof of the MEMS layer.
摘要翻译： MEMS集成电路包括具有驱动电路层和背面的前侧的硅衬底。 MEMS层设置在驱动电路层上。 MEMS层包括电连接到驱动电路层的多个MEMS器件。 连接器柱从驱动电路层延伸到位于MEMS层的顶部的接触焊盘，以及从接触焊盘穿过驱动电路层和硅衬底线性地延伸到硅衬底的背面的贯穿硅连接器。 每个贯通硅连接器终止于背面集成电路触点，使得每个集成电路触点经由位于MEMS层的顶部中的接触垫电连接到驱动电路层。
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10.发明授权公开(公告)号：US08287094B2
公开(公告)日：2012-10-16
申请号：US12509488
申请日：2009-07-27
CPC分类号： B41J2/1601 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1639 , B41J2/1642 , B41J2/1645
摘要： A printhead integrated circuit has a frontside comprising drive circuitry and inkjet nozzle assemblies, a backside for attachment to an ink supply manifold and ink supply channels providing fluid communication between the backside and the inkjet nozzle assemblies. The backside has a recessed portion for accommodating part of a connector film, which supplies power to the drive circuitry.
摘要翻译： 打印头集成电路具有前端，其包括驱动电路和喷墨喷嘴组件，用于连接到供墨歧管的背面和用于提供背面与喷墨喷嘴组件之间的流体连通的供墨通道。 背面具有用于容纳连接器膜的一部分的凹入部分，其向驱动电路供电。
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