发明授权
- 专利标题： Substrate processing system
- 专利标题（中）： 基板加工系统
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申请号： US11990499申请日： 2007-01-24
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公开(公告)号： US08506714B2公开(公告)日： 2013-08-13
- 发明人: Tomoki Horita , Kazuhiro Hirahara , Hironobu Miya , Atsuhiko Suda , Hirohisa Yamazaki
- 申请人： Tomoki Horita , Kazuhiro Hirahara , Hironobu Miya , Atsuhiko Suda , Hirohisa Yamazaki
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Kokusai Electric Inc.
- 当前专利权人： Hitachi Kokusai Electric Inc.
- 当前专利权人地址： JP Tokyo
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： JP2006-015295 20060124; JP2006-255635 20060921
- 国际申请： PCT/JP2007/051038 WO 20070124
- 国际公布： WO2007/086393 WO 20070802
- 主分类号： C23C16/455
- IPC分类号： C23C16/455 ; C23C16/453 ; C23C16/52 ; C23C16/06 ; C23C16/22
摘要：
Disclosed is a substrate processing system, including: a processing chamber to process a substrate; a vaporizing unit to vaporize a material of liquid; a supply system to supply the processing chamber with gas of the material vaporized by the vaporizing unit; an exhaust system to exhaust an atmosphere in the processing chamber; and a cleaning liquid supply system to supply the vaporizing unit with cleaning liquid for cleaning a product deposited in the vaporizing unit, wherein the cleaning liquid supply system supplies at least two kinds of cleaning liquids into the vaporizing unit so that the product can be removed from the vaporizing unit by action of the two kinds of cleaning liquids on the product.
公开/授权文献
- US20080302302A1 Substrate Processing System 公开/授权日：2008-12-11
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