Invention Grant
- Patent Title: Apparatus and method for applying a film on a substrate
- Patent Title (中): 在基材上涂膜的设备和方法
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Application No.: US13218733Application Date: 2011-08-26
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Publication No.: US08507048B2Publication Date: 2013-08-13
- Inventor: Kyekyoon Kim , Hyungsoo Choi
- Applicant: Kyekyoon Kim , Hyungsoo Choi
- Applicant Address: US IL Urbana
- Assignee: The Board of Trustees of the University of Illinois
- Current Assignee: The Board of Trustees of the University of Illinois
- Current Assignee Address: US IL Urbana
- Agency: Guntin & Gust, PLC
- Agent Ed Guntin
- Main IPC: B05D1/04
- IPC: B05D1/04

Abstract:
The subject disclosure provides a method for applying dissimilar electrical charges to portions of a plurality of applicators by way of a conductor included in a conduit of each applicator. The method further includes causing each applicator to generate one or more jet sprays of a liquid received by each applicator for application of a material on a substrate, where one or more portions of the material on the substrate have one or more net charges associated with the dissimilar electrical charges applied to the portions of the plurality of applicators, where the conductor of each applicator is a sleeve positioned in the applicator, and where a diameter of the sleeve results in one of an outer surface of the sleeve contacting a surface of the conduit, or the outer surface of the sleeve having a separation from the surface of the conduit of the applicator. Additional embodiments are disclosed.
Public/Granted literature
- US20110311731A1 APPARATUS AND METHOD FOR APPLYING A FILM ON A SUBSTRATE Public/Granted day:2011-12-22
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