发明授权
- 专利标题: Apparatus and method for applying a film on a substrate
- 专利标题(中): 在基材上涂膜的设备和方法
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申请号: US13218733申请日: 2011-08-26
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公开(公告)号: US08507048B2公开(公告)日: 2013-08-13
- 发明人: Kyekyoon Kim , Hyungsoo Choi
- 申请人: Kyekyoon Kim , Hyungsoo Choi
- 申请人地址: US IL Urbana
- 专利权人: The Board of Trustees of the University of Illinois
- 当前专利权人: The Board of Trustees of the University of Illinois
- 当前专利权人地址: US IL Urbana
- 代理机构: Guntin & Gust, PLC
- 代理商 Ed Guntin
- 主分类号: B05D1/04
- IPC分类号: B05D1/04
摘要:
The subject disclosure provides a method for applying dissimilar electrical charges to portions of a plurality of applicators by way of a conductor included in a conduit of each applicator. The method further includes causing each applicator to generate one or more jet sprays of a liquid received by each applicator for application of a material on a substrate, where one or more portions of the material on the substrate have one or more net charges associated with the dissimilar electrical charges applied to the portions of the plurality of applicators, where the conductor of each applicator is a sleeve positioned in the applicator, and where a diameter of the sleeve results in one of an outer surface of the sleeve contacting a surface of the conduit, or the outer surface of the sleeve having a separation from the surface of the conduit of the applicator. Additional embodiments are disclosed.
公开/授权文献
- US20110311731A1 APPARATUS AND METHOD FOR APPLYING A FILM ON A SUBSTRATE 公开/授权日:2011-12-22
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