发明授权
US08507317B2 Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore
有权
因此，倒装芯片半导体器件的焊接凸块结构及其制造方法
- 专利标题： Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore
- 专利标题（中）： 因此，倒装芯片半导体器件的焊接凸块结构及其制造方法
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申请号： US13093032申请日： 2011-04-25
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公开(公告)号： US08507317B2公开(公告)日： 2013-08-13
- 发明人: Mark A. Bachman , Donald S. Bitting , Sailesh Chittipeddi , Seung H. Kang , Sailesh M. Merchant
- 申请人： Mark A. Bachman , Donald S. Bitting , Sailesh Chittipeddi , Seung H. Kang , Sailesh M. Merchant
- 申请人地址： US CA Milpitas
- 专利权人： Agere Systems LLC
- 当前专利权人： Agere Systems LLC
- 当前专利权人地址： US CA Milpitas
- 主分类号： H01L21/60
- IPC分类号： H01L21/60
摘要：
The invention provides, in one aspect, a semiconductor device that comprises an interconnect layer located over a semiconductor substrate. A passivation layer is located over the interconnect layer and having a solder bump support opening formed therein. Support pillars that comprise a conductive material are located within the solder bump support opening.
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