发明授权
- 专利标题： Semiconductor device utilizing a package on package structure and manufacturing method thereof
- 专利标题（中）： 利用封装结构的封装的半导体器件及其制造方法
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申请号： US13298425申请日： 2011-11-17
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公开(公告)号： US08508048B2公开(公告)日： 2013-08-13
- 发明人: Hiroshi Honjo
- 申请人： Hiroshi Honjo
- 申请人地址： JP
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP
- 代理机构： Sheridan Ross P.C.
- 优先权： JP2010-269105 20101202
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/56 ; H01L21/58
摘要：
A semiconductor device which includes a substrate, a semiconductor chip which is mounted on the substrate, a package in which an upper surface of the substrate and the semiconductor chip are sealed using an insulating material, and a molding material which is exposed to the upper surface of the package. In addition, the device includes a lead of which one end is connected to the mold material and the other end is electrically connected to the substrate, which is integrally formed of the same material as from a connection portion with the mold material to a connection portion with the substrate, and of which the connection portion with the mold material is exposed to the upper surface of the package.
公开/授权文献
- US20120139122A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 公开/授权日：2012-06-07
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