发明授权
- 专利标题： Ultrasonic bonding systems and methods of using the same
- 专利标题（中）： 超声波接合系统及其使用方法
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申请号： US13578702申请日： 2011-03-30
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公开(公告)号： US08511536B2公开(公告)日： 2013-08-20
- 发明人: Christoph B. Luechinger , Orlando L. Valentin , Tao Xu
- 申请人： Christoph B. Luechinger , Orlando L. Valentin , Tao Xu
- 申请人地址： US CA Irvine
- 专利权人： Orthodyne Electronics Corporation
- 当前专利权人： Orthodyne Electronics Corporation
- 当前专利权人地址： US CA Irvine
- 国际申请： PCT/US2011/030537 WO 20110330
- 国际公布： WO2011/123539 WO 20111006
- 主分类号： B23K31/02
- IPC分类号： B23K31/02
摘要：
An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool supported by the bond head assembly. The system further includes a pressing member adapted to press against a bonding material bonded using the bonding tool. The pressing member is supported by the bond head assembly and is movable with respect to the bond head assembly independent of the bonding tool. The ultrasonic bonding system may also be an ultrasonic ribbon bonding system or a solar cell ribbon bonding system for bonding a ribbon material to portions of a solar cell.
公开/授权文献
- US20130140346A1 ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME 公开/授权日：2013-06-06
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