In an optical device 1 in which a wavelength converting element 20 is disposed as an optical element on a silicon substrate 10, configuration includes heaters 40a and 40b formed on the silicon substrate 10; and micro bumps 30a, 30b that are made of Au, that bond the silicon substrate 10 and the wavelength converting element 20, and that transfer the heat generated by the heaters 40a, 40b to the wavelength converting element 20.