公开(公告)号：US08515219B2

公开(公告)日：2013-08-20

申请号：US13108133

申请日：2011-05-16

申请人： Yosuke Abe ,  Masafumi Ide ,  Toru Takizawa ,  Takaaki Nozaki

发明人： Yosuke Abe ,  Masafumi Ide ,  Toru Takizawa ,  Takaaki Nozaki

IPC分类号： G02B6/12

CPC分类号： H01S5/02248 ,  G02F1/0147 ,  G02F1/025 ,  G02F1/377 ,  G02F2001/3546 ,  H01S5/0092

摘要： In an optical device 1 in which a wavelength converting element 20 is disposed as an optical element on a silicon substrate 10, configuration includes heaters 40a and 40b formed on the silicon substrate 10; and micro bumps 30a, 30b that are made of Au, that bond the silicon substrate 10 and the wavelength converting element 20, and that transfer the heat generated by the heaters 40a, 40b to the wavelength converting element 20.

摘要翻译： 在其中将波长转换元件20作为光学元件设置在硅基板10上的光学装置1中，构造包括形成在硅基板10上的加热器40a和40b; 以及由Au制成的微凸块30a，30b，其接合硅衬底10和波长转换元件20，并将由加热器40a，40b产生的热量传递到波长转换元件20。

公开(公告)号：US20130022323A1

公开(公告)日：2013-01-24

申请号：US13554524

申请日：2012-07-20

申请人： Toru TAKIZAWA ,  Kaoru YODA

发明人： Toru TAKIZAWA ,  Kaoru YODA

IPC分类号： G02B6/42 ,  G02B6/36

CPC分类号： G02B6/4233 ,  G02B6/262 ,  G02B6/3652 ,  G02B6/4224 ,  G02B6/4225 ,  G02B6/4232 ,  G02B6/4243 ,  G02B2006/12147 ,  G02F2001/3505 ,  H01S5/0092 ,  H01S5/022 ,  H01S5/02252 ,  H01S5/02284 ,  H01S5/4012 ,  H01S5/4093

摘要： On a mounting substrate 101, an LD element 102 and a wavelength converter element 103 are mounted as optical elements. An end of an optical fiber 105 is fixed, at a given length, in a fiber anchoring groove 301 of a sub-substrate 104. The sub-substrate 104 is mounted to the mounting substrate 101 with the surface supporting the optical fiber 105 opposing thereto, and the wavelength converter element 103 and the optical fiber 105 being coupled. By mounting of the sub-substrate 104 to the mounting substrate 101, the coupling position of the output end of the wavelength converter element 103 and the input end of the optical fiber 105 is provided an internal position that is a given distance from the end of mounting substrate 101.

摘要翻译： 在安装基板101上安装有LD元件102和波长转换元件103作为光学元件。 光纤105的端部以给定的长度固定在子基板104的光纤固定槽301中。子基板104被安装到安装基板101，表面支撑与其相对的光纤105 ，波长转换元件103和光纤105耦合。 通过将辅助基板104安装到安装基板101上，波长转换元件103的输出端和光纤105的输入端的耦合位置设置有内部位置，该位置距离 安装基板101。

公开(公告)号：US20120068609A1

公开(公告)日：2012-03-22

申请号：US13305428

申请日：2011-11-28

申请人： Masafumi Ide ,  Toru Takizawa

发明人： Masafumi Ide ,  Toru Takizawa

IPC分类号： H05B37/02

CPC分类号： G02B6/12007 ,  G02B6/12004 ,  G02B6/4215

摘要： In a light source device for combining light waves with at least three wavelengths and outputting thus combined light waves, an optical system element and an electrical system element are formed on a semiconductor substrate, thereby eliminating the necessity of optical members such as an optical connector, and saving space to place the optical members as well as reducing arrangement spacing. In addition, the space necessary for wiring in an electrical circuit is reduced. Therefore, an integration degree of each of the elements, the optical system element and the electrical system element, is enhanced. The optical system element and the electrical system element are formed in layers on the same conductor substrate, thereby reducing the area that is required in configuring a parallel establishment of the optical system element and the electrical system element.

摘要翻译： 在用于组合具有至少三个波长的光波并输出这样组合的光波的光源装置中，在半导体衬底上形成光学系统元件和电气系统元件，由此消除了诸如光学连接器等光学部件的需要， 并节省空间以放置光学构件以及减少布置间隔。 此外，减少了在电路中布线所需的空间。 因此，提高了各元件，光学系统元件和电气系统元件的集成度。 光学系统元件和电气系统元件以相同的导体衬底上的层形成，从而减少了在配置光学系统元件和电气系统元件的并行建立所需的面积。

公开(公告)号：US08704447B2

公开(公告)日：2014-04-22

申请号：US13305428

申请日：2011-11-28

申请人： Masafumi Ide ,  Toru Takizawa

发明人： Masafumi Ide ,  Toru Takizawa

IPC分类号： H05B37/02

CPC分类号： G02B6/12007 ,  G02B6/12004 ,  G02B6/4215

摘要： In a light source device for combining light waves with at least three wavelengths and outputting thus combined light waves, an optical system element and an electrical system element are formed on a semiconductor substrate, thereby eliminating the necessity of optical members such as an optical connector, and saving space to place the optical members as well as reducing arrangement spacing. In addition, the space necessary for wiring in an electrical circuit is reduced. Therefore, an integration degree of each of the elements, the optical system element and the electrical system element, is enhanced. The optical system element and the electrical system element are formed in layers on the same conductor substrate, thereby reducing the area that is required in configuring a parallel establishment of the optical system element and the electrical system element.

摘要翻译： 在用于组合具有至少三个波长的光波并输出这样组合的光波的光源装置中，在半导体衬底上形成光学系统元件和电气系统元件，由此消除了诸如光学连接器等光学部件的需要， 并节省空间以放置光学构件以及减少布置间隔。 此外，减少了在电路中布线所需的空间。 因此，提高了各元件，光学系统元件和电气系统元件的集成度。 光学系统元件和电气系统元件以相同的导体衬底上的层形成，从而减少了在配置光学系统元件和电气系统元件的并行建立所需的面积。

公开(公告)号：US20110280512A1

公开(公告)日：2011-11-17

申请号：US13108133

申请日：2011-05-16

申请人： Yosuke ABE ,  Masafumi Ide ,  Toru Takizawa ,  Takaaki Nozaki

发明人： Yosuke ABE ,  Masafumi Ide ,  Toru Takizawa ,  Takaaki Nozaki

IPC分类号： G02B6/12

CPC分类号： H01S5/02248 ,  G02F1/0147 ,  G02F1/025 ,  G02F1/377 ,  G02F2001/3546 ,  H01S5/0092

摘要： In an optical device 1 in which a wavelength converting element 20 is disposed as an optical element on a silicon substrate 10, configuration includes heaters 40a and 40b formed on the silicon substrate 10; and micro bumps 30a, 30b that are made of Au, that bond the silicon substrate 10 and the wavelength converting element 20, and that transfer the heat generated by the heaters 40a, 40b to the wavelength converting element 20.

摘要翻译： 在其中将波长转换元件20作为光学元件设置在硅基板10上的光学装置1中，构造包括形成在硅基板10上的加热器40a和40b; 以及由Au制成的微凸块30a，30b，其接合硅衬底10和波长转换元件20，并将由加热器40a，40b产生的热量传递到波长转换元件20。

公开(公告)号：US20060219025A1

公开(公告)日：2006-10-05

申请号：US11376435

申请日：2006-03-16

申请人： Toru Takizawa

发明人： Toru Takizawa

IPC分类号： G01B7/16

CPC分类号： G01P15/123 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/084

摘要： A weight part (12) is supported by a beam part (26) in a slim piece shape supported by a frame-shaped support part (10), and the beam part (26) is provided with a piezoresistance element (20) as a transducing element that transduces a mechanical variation to an electrical variation, so that a mechanical variation of the weight part (12) is transmitted to the piezoresistance element (20) via the beam part (26). Then, the beam part (26) is constructed by stacking the silicon nitride film (16) and a resin film (18) such as a polyimide film.

摘要翻译： 重物部分（12）由梁部分（26）以由框状支撑部分（10）支撑的细长形状支撑，并且梁部分（26）设置有压电元件（20）作为 转换元件，其将机械变化转换成电变化，使得重量部件（12）的机械变化通过梁部分（26）传递到压阻元件（20）。 然后，通过层叠氮化硅膜（16）和聚酰亚胺膜等树脂膜（18）构成光束部（26）。

公开(公告)号：US06404017B1

公开(公告)日：2002-06-11

申请号：US09688384

申请日：2000-10-17

申请人： Toru Takizawa ,  Toshio Imai

发明人： Toru Takizawa ,  Toshio Imai

IPC分类号： H01L2362

CPC分类号： H01L27/0266

摘要： A current when static electricity intrudes is passed by a first circuit portion composed of a series circuit including a fuse element and a resistor until a program voltage is applied to a program voltage terminal, and the fuse element is fused when the program voltage is applied. A current for breaking the fuse element is passed when an N-type MOS transistor turns into a second breakdown state by a gate voltage from a second circuit portion.

摘要翻译： 当由包括熔丝元件和电阻器的串联电路组成的第一电路部分通过静电导通的电流，直到编程电压被施加到编程电压端子，并且当施加编程电压时熔丝元件熔断。 当N型MOS晶体管通过来自第二电路部分的栅极电压变为第二击穿状态时，断开熔丝元件的电流通过。

公开(公告)号：US5962878A

公开(公告)日：1999-10-05

申请号：US154169

申请日：1998-09-16

申请人： Toru Takizawa

发明人： Toru Takizawa

IPC分类号： H01L21/329 ,  H01L29/86 ,  H01L29/87 ,  H01L29/74 ,  H01L31/111

CPC分类号： H01L29/6609 ,  H01L29/86 ,  H01L29/87

摘要： In a bidirectional surge protection device formed on a semiconductor substrate, buried layers, which have the same conduction type as and are higher in impurity concentration than the semiconductor substrate, are formed on the entire surfaces of the device regions provided on both surfaces of the semiconductor substrate or formed under emitter-push restraining layers alone, wherein injection of minority carriers from a surface opposite to the surface on which the device operates is restrained to lower a holding current. As a result, the bidirectional surge protection device easily becomes OFF once it becomes ON.

摘要翻译： 在形成在半导体衬底上的双向电涌保护器件中，在半导体衬底的两个表面上设置的器件区域的整个表面上形成了具有与半导体衬底相同的导电类型和高于杂质浓度的掩埋层 衬底或仅在发射极 - 推动抑制层下形成，其中抑制了从与器件工作的表面相对的表面的少数载流子的注入以降低保持电流。 结果，双向浪涌保护装置一旦接通就容易变为OFF。

公开(公告)号：US5932488A

公开(公告)日：1999-08-03

申请号：US796837

申请日：1997-02-07

申请人： Toru Takizawa ,  Kathuhiko Nishiwaki

发明人： Toru Takizawa ,  Kathuhiko Nishiwaki

IPC分类号： H01L21/3213 ,  C03C15/00

CPC分类号： H01L21/32137

摘要： A dry etching method utilizing electron cyclotron resonance excited by microwaves is divided into at least a first etching step for etching a region which extends to the vicinity of a boundary between the non-etching layer and the etching layer but does not reach the non-etching layer and a second etching step conducted after the first etching step.At least one among the four control factors of output power of the magnetron, electron cyclotron resonance point, etching pressure and magnetic field intensity distribution or a combination of five control factors including the foregoing four plus a high-frequency bias power applied to the rear surface of the object to be etched is changed as desired between the first etching step and the second etching step.

摘要翻译： 利用由微波激发的电子回旋共振的干蚀刻方法被划分为至少第一蚀刻步骤，用于蚀刻延伸到非蚀刻层和蚀刻层之间的边界附近但不达到非蚀刻的区域 层和在第一蚀刻步骤之后进行的第二蚀刻步骤。 磁控管的输出功率，电子回旋共振点，蚀刻压力和磁场强度分布的四个控制因素中的至少一个或包括上述四个加上施加到后表面的高频偏置功率的五个控制因素的组合 的待蚀刻对象在第一蚀刻步骤和第二蚀刻步骤之间根据需要改变。

公开(公告)号：US09049806B2

公开(公告)日：2015-06-02

申请号：US12949488

申请日：2010-11-18

申请人： Masafumi Ide ,  Toru Takizawa ,  Kaoru Yoda

发明人： Masafumi Ide ,  Toru Takizawa ,  Kaoru Yoda

IPC分类号： G02F2/02 ,  G02B6/12 ,  H05K3/32 ,  G02B6/42 ,  H05K1/11 ,  G02F1/35 ,  H01S5/022 ,  H05K1/02 ,  H05K1/03

CPC分类号： H05K3/32 ,  G02B6/12007 ,  G02B6/4215 ,  G02B6/4232 ,  G02F2001/3505 ,  H01L24/83 ,  H01L2924/14 ,  H01L2924/351 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/02276 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/111 ,  H05K2201/0373 ,  H05K2201/09745 ,  H05K2201/10121 ,  H05K2201/10674 ,  H05K2203/0369 ,  H05K2203/095 ,  Y02P70/611 ,  H01L2924/00

摘要： An integrated device includes an optical element and an electrical element that are implemented on a substrate. The optical element and the electrical element are bonded by surface-activated bonding technology to a bonding portion that is formed on the substrate and made of metal material.

摘要翻译： 集成器件包括实现在衬底上的光学元件和电子元件。 光学元件和电气元件通过表面激活键合技术结合到形成在基板上并由金属材料制成的接合部分。