发明授权
- 专利标题： Process for fabricating integrated-circuit chips
- 专利标题（中）： 集成电路芯片制造工艺
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申请号： US13315441申请日： 2011-12-09
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公开(公告)号： US08518802B2公开(公告)日： 2013-08-27
- 发明人: Laurent-Luc Chapelon , Julien Cuzzocrea
- 申请人： Laurent-Luc Chapelon , Julien Cuzzocrea
- 申请人地址： FR Crolles Cedex
- 专利权人： STMicroelectronics (Crolles 2) SAS
- 当前专利权人： STMicroelectronics (Crolles 2) SAS
- 当前专利权人地址： FR Crolles Cedex
- 代理机构： Gardere Wynne Sewell LLP
- 优先权： FR1060639 20101216
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
Integrated-circuit chips are fabricated according to a process wherein weak portions are formed in a substrate wafer surrounding a plurality of locations. An integrated-circuit chip is defined at each location by destroying the weak portions so as to singulate integrated-circuit chips.
公开/授权文献
- US20120153425A1 PROCESS FOR FABRICATING INTEGRATED-CIRCUIT CHIPS 公开/授权日：2012-06-21