发明授权
- 专利标题： Wireless telemetry electronic circuit board for high temperature environments
- 专利标题（中）： 无线遥测电子电路板用于高温环境
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申请号： US13235984申请日： 2011-09-19
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公开(公告)号： US08525036B2公开(公告)日： 2013-09-03
- 发明人: David J. Mitchell , Anand A. Kulkarni , Ramesh Subramanian , Edward R. Roesch , Rod Waits , Roberto Schupbach , John R. Fraley , Alexander B. Lostetter , Brice McPherson , Bryon Western
- 申请人： David J. Mitchell , Anand A. Kulkarni , Ramesh Subramanian , Edward R. Roesch , Rod Waits , Roberto Schupbach , John R. Fraley , Alexander B. Lostetter , Brice McPherson , Bryon Western
- 申请人地址： US FL Orlando
- 专利权人： Siemens Energy, Inc.
- 当前专利权人： Siemens Energy, Inc.
- 当前专利权人地址： US FL Orlando
- 主分类号： H05K1/00
- IPC分类号： H05K1/00
摘要：
A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.