Invention Grant
- Patent Title: Flip-chip QFN structure using etched lead frame
- Patent Title (中): 使用蚀刻引线框的倒装QFN结构
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Application No.: US13173883Application Date: 2011-06-30
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Publication No.: US08525309B2Publication Date: 2013-09-03
- Inventor: Chok Chia , Qwai Low , Kishor Desai , Charles G. Woychik
- Applicant: Chok Chia , Qwai Low , Kishor Desai , Charles G. Woychik
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/50 ; H01L23/34 ; H01L21/60 ; H01R43/16
Abstract:
A microelectronic unit can include a lead frame and a device chip. The lead frame can have a plurality of monolithic lead fingers extending in a plane of the lead frame. Each lead finger can have a fan-out portion and a chip connection portion extending in the lead frame plane. The fan-out portions can have first and second opposed surfaces and a first thickness in a first direction between the opposed surfaces. The chip connection portions can have a second thickness smaller than the first thickness. The chip connection portions can define a recess below the first surface. The device chip can have a plurality of at least one of passive devices or active devices. The device chip can have contacts thereon facing the chip connection portions and electrically coupled thereto. At least a portion of a thickness of the device chip can extend within the recess.
Public/Granted literature
- US20130001757A1 FLIP-CHIP QFN STRUCTURE USING ETCHED LEAD FRAME Public/Granted day:2013-01-03
Information query
IPC分类:
