公开(公告)号：US08525309B2

公开(公告)日：2013-09-03

申请号：US13173883

申请日：2011-06-30

申请人： Chok Chia ,  Qwai Low ,  Kishor Desai ,  Charles G. Woychik

发明人： Chok Chia ,  Qwai Low ,  Kishor Desai ,  Charles G. Woychik

IPC分类号： H01L23/495 ,  H01L21/50 ,  H01L23/34 ,  H01L21/60 ,  H01R43/16

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L25/105 ,  H01L2224/11332 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/1329 ,  H01L2224/13311 ,  H01L2224/13313 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/1339 ,  H01L2224/13401 ,  H01L2224/16245 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/81192 ,  H01L2224/8184 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07811 ,  Y10T29/49204 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/00

摘要： A microelectronic unit can include a lead frame and a device chip. The lead frame can have a plurality of monolithic lead fingers extending in a plane of the lead frame. Each lead finger can have a fan-out portion and a chip connection portion extending in the lead frame plane. The fan-out portions can have first and second opposed surfaces and a first thickness in a first direction between the opposed surfaces. The chip connection portions can have a second thickness smaller than the first thickness. The chip connection portions can define a recess below the first surface. The device chip can have a plurality of at least one of passive devices or active devices. The device chip can have contacts thereon facing the chip connection portions and electrically coupled thereto. At least a portion of a thickness of the device chip can extend within the recess.

摘要翻译： 微电子单元可以包括引线框架和器件芯片。 引线框架可以具有在引线框架的平面中延伸的多个单片引线指。 每个引线指可以具有在引线框架平面中延伸的扇出部分和芯片连接部分。 扇出部分可以在相对的表面之间具有第一和第二相对表面以及在第一方向上的第一厚度。 芯片连接部分可以具有小于第一厚度的第二厚度。 芯片连接部分可以限定第一表面下方的凹陷。 器件芯片可以具有多个无源器件或有源器件中的至少一个。 器件芯片可以具有面向芯片连接部分并且与其电耦合的触点。 装置芯片的厚度的至少一部分可以在凹部内延伸。

公开(公告)号：US20130001757A1

公开(公告)日：2013-01-03

申请号：US13173883

申请日：2011-06-30

申请人： Chok Chia ,  Qwai Low ,  Kishor Desai ,  Charles G. Woychik

发明人： Chok Chia ,  Qwai Low ,  Kishor Desai ,  Charles G. Woychik

IPC分类号： H01L23/495 ,  H01R43/16 ,  H01L21/50 ,  H01L23/34 ,  H01L21/60

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L25/105 ,  H01L2224/11332 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/1329 ,  H01L2224/13311 ,  H01L2224/13313 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/1339 ,  H01L2224/13401 ,  H01L2224/16245 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/81192 ,  H01L2224/8184 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07811 ,  Y10T29/49204 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/00

摘要： A microelectronic unit can include a lead frame and a device chip. The lead frame can have a plurality of monolithic lead fingers extending in a plane of the lead frame. Each lead finger can have a fan-out portion and a chip connection portion extending in the lead frame plane. The fan-out portions can have first and second opposed surfaces and a first thickness in a first direction between the opposed surfaces. The chip connection portions can have a second thickness smaller than the first thickness. The chip connection portions can define a recess below the first surface. The device chip can have a plurality of at least one of passive devices or active devices. The device chip can have contacts thereon facing the chip connection portions and electrically coupled thereto. At least a portion of a thickness of the device chip can extend within the recess.

摘要翻译： 微电子单元可以包括引线框架和器件芯片。 引线框架可以具有在引线框架的平面中延伸的多个单片引线指。 每个引线指可以具有在引线框架平面中延伸的扇出部分和芯片连接部分。 扇出部分可以在相对的表面之间具有第一和第二相对表面以及在第一方向上的第一厚度。 芯片连接部分可以具有小于第一厚度的第二厚度。 芯片连接部分可以限定第一表面下方的凹陷。 器件芯片可以具有多个无源器件或有源器件中的至少一个。 器件芯片可以具有面向芯片连接部分并且与其电耦合的触点。 装置芯片的厚度的至少一部分可以在凹部内延伸。

公开(公告)号：US20120314384A1

公开(公告)日：2012-12-13

申请号：US13156609

申请日：2011-06-09

申请人： Charles G. Woychik ,  Kishor Desai ,  Ilyas Mohammed ,  Terrence Caskey

发明人： Charles G. Woychik ,  Kishor Desai ,  Ilyas Mohammed ,  Terrence Caskey

IPC分类号： H05K5/00 ,  H01L21/768 ,  H05K7/00 ,  H05K1/09 ,  H05K1/11 ,  H05K1/00

CPC分类号： H05K3/0094 ,  B23K1/0016 ,  B23K35/24 ,  B23K35/36 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/49883 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/09701 ,  Y10T29/49165 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552

摘要： A component can include a substrate having a first surface and a second surface remote therefrom, an opening extending in a direction between the first and second surfaces, and a conductive via extending within the opening. The substrate can have a CTE less than 10 ppm/° C. The conductive via can include a plurality of base particles each including a first region of a first metal substantially covered by a layer of a second metal different from the first metal. The base particles can be metallurgically joined together and the second metal layers of the particles can be at least partially diffused into the first regions. The conductive via can include voids interspersed between the joined base particles. The voids can occupy 10% or more of a volume of the conductive via.

摘要翻译： 部件可以包括具有第一表面和远离其的第二表面的基板，沿着第一和第二表面之间的方向延伸的开口以及在开口内延伸的导电通孔。 基底可以具有小于10ppm /℃的CTE。导电通孔可以包括多个基础颗粒，每个基底颗粒包括基本上被不同于第一金属的第二金属层覆盖的第一金属的第一区域。 基础颗粒可以冶金学连接在一起，并且颗粒的第二金属层可以至少部分地扩散到第一区域中。 导电通孔可以包括散布在接合的基础颗粒之间的空隙。 空隙可以占据导电通孔体积的10％或更多。

公开(公告)号：US08963310B2

公开(公告)日：2015-02-24

申请号：US13216918

申请日：2011-08-24

申请人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

发明人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

IPC分类号： H01L23/495 ,  H01L23/02 ,  H01L23/48 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/49575 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic assembly includes a substrate, a first and second microelectronic elements, a lead finger, electrical connections extending between contacts of the second microelectronic element and the lead fingers, and an encapsulant overlying at least portions of the first and second microelectronic elements, lead finger and electrical connections. The substrate has contacts at a first surface and terminals at an opposed second surface that are electrically connected with the substrate contacts. The first microelectronic element has contacts exposed at its front face. The front face of the first microelectronic element is joined to the substrate contacts. The second microelectronic element overlies the first microelectronic element and has contacts at a front face facing away from the substrate. The lead frame has lead fingers, wherein the second surface of the substrate and the lead fingers define a common interface for electrical interconnection to a component external to the microelectronic assembly.

摘要翻译： 微电子组件包括衬底，第一和第二微电子元件，引线指，在第二微电子元件的触点和引线指之间延伸的电连接，以及覆盖第一和第二微电子元件的至少一部分的引线指 和电气连接。 基板在第一表面具有接触，在相对的第二表面具有与基板触点电连接的端子。 第一微电子元件在其前面具有暴露的触点。 第一微电子元件的正面连接到基板触点。 第二微电子元件覆盖第一微电子元件并且在面向背离衬底的前面具有接触。 引线框架具有引线指，其中基板的第二表面和引线指限定用于与微电子组件外部的部件的电互连的公共接口。

公开(公告)号：US20130049179A1

公开(公告)日：2013-02-28

申请号：US13216918

申请日：2011-08-24

申请人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

发明人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49575 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic assembly includes a substrate, a first and second microelectronic elements, a lead finger, electrical connections extending between contacts of the second microelectronic element and the lead fingers, and an encapsulant overlying at least portions of the first and second microelectronic elements, lead finger and electrical connections. The substrate has contacts at a first surface and terminals at an opposed second surface that are electrically connected with the substrate contacts. The first microelectronic element has contacts exposed at its front face. The front face of the first microelectronic element is joined to the substrate contacts. The second microelectronic element overlies the first microelectronic element and has contacts at a front face facing away from the substrate. The lead frame has lead fingers, wherein the second surface of the substrate and the lead fingers define a common interface for electrical interconnection to a component external to the microelectronic assembly.

公开(公告)号：US08723049B2

公开(公告)日：2014-05-13

申请号：US13156609

申请日：2011-06-09

申请人： Charles G. Woychik ,  Kishor Desai ,  Ilyas Mohammed ,  Terrence Caskey

发明人： Charles G. Woychik ,  Kishor Desai ,  Ilyas Mohammed ,  Terrence Caskey

IPC分类号： H05K1/11

CPC分类号： H05K3/0094 ,  B23K1/0016 ,  B23K35/24 ,  B23K35/36 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/49883 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/09701 ,  Y10T29/49165 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552

摘要： A component can include a substrate having a first surface and a second surface remote therefrom, an opening extending in a direction between the first and second surfaces, and a conductive via extending within the opening. The substrate can have a CTE less than 10 ppm/° C. The conductive via can include a plurality of base particles each including a first region of a first metal substantially covered by a layer of a second metal different from the first metal. The base particles can be metallurgically joined together and the second metal layers of the particles can be at least partially diffused into the first regions. The conductive via can include voids interspersed between the joined base particles. The voids can occupy 10% or more of a volume of the conductive via.

摘要翻译： 部件可以包括具有第一表面和远离其的第二表面的基板，沿着第一和第二表面之间的方向延伸的开口以及在开口内延伸的导电通孔。 基底可以具有小于10ppm /℃的CTE。导电通孔可以包括多个基础颗粒，每个基底颗粒包括基本上被不同于第一金属的第二金属层覆盖的第一金属的第一区域。 基础颗粒可以冶金学连接在一起，并且颗粒的第二金属层可以至少部分地扩散到第一区域中。 导电通孔可以包括散布在接合的基础颗粒之间的空隙。 空隙可以占据导电通孔体积的10％或更多。

公开(公告)号：US08525312B2

公开(公告)日：2013-09-03

申请号：US13208822

申请日：2011-08-12

申请人： Qwai H. Low ,  Chok J. Chia ,  Kishor Desai ,  Charles G. Woychik ,  Huailiang Wei

发明人： Qwai H. Low ,  Chok J. Chia ,  Kishor Desai ,  Charles G. Woychik ,  Huailiang Wei

IPC分类号： H01L23/495 ,  H01L21/50 ,  H01L21/60

CPC分类号： H01L23/49537 ,  H01L21/4821 ,  H01L23/3121 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83

摘要： A microelectronic assembly can include a microelectronic element and a lead frame having a first unit and a second unit overlying the first unit and assembled therewith. The first unit can have a first metal layer comprising a portion of the thickness of the lead frame and including terminals and first conductive elements extending away therefrom. The second unit can have a second metal layer comprising a portion of the thickness of the lead frame and including bond pads and second conductive elements extending away therefrom. The first and second units each can have an encapsulation supporting at least portions of the respective first and second conductive elements. At least some of the second conductive elements can overlie portions of corresponding ones of the first conductive elements and can be joined thereto. The microelectronic element can have contacts electrically connected with the bond pads of the lead frame.

摘要翻译： 微电子组件可以包括微电子元件和引线框架，引线框架具有覆盖第一单元并与其组装的第一单元和第二单元。 第一单元可以具有包括引线框架的厚度的一部分的第一金属层，并且包括端子和从其延伸的第一导电元件。 第二单元可以具有包括引线框架的厚度的一部分的第二金属层，并且包括接合焊盘和从其延伸的第二导电元件。 第一和第二单元各自可以具有支撑相应的第一和第二导电元件的至少一部分的封装。 至少一些第二导电元件可以覆盖相应的第一导电元件的部分并且可以与其连接。 微电子元件可以具有与引线框架的接合焊盘电连接的触点。

公开(公告)号：US20130037925A1

公开(公告)日：2013-02-14

申请号：US13208822

申请日：2011-08-12

申请人： Qwai H. Low ,  Chok J. Chia ,  Kishor Desai ,  Charles G. Woychik ,  Huailiang Wei

发明人： Qwai H. Low ,  Chok J. Chia ,  Kishor Desai ,  Charles G. Woychik ,  Huailiang Wei

IPC分类号： H01L23/495 ,  H01L21/50 ,  H01L21/60

CPC分类号： H01L23/49537 ,  H01L21/4821 ,  H01L23/3121 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83

摘要： A microelectronic assembly can include a microelectronic element and a lead frame having a first unit and a second unit overlying the first unit and assembled therewith. The first unit can have a first metal layer comprising a portion of the thickness of the lead frame and including terminals and first conductive elements extending away therefrom. The second unit can have a second metal layer comprising a portion of the thickness of the lead frame and including bond pads and second conductive elements extending away therefrom. The first and second units each can have an encapsulation supporting at least portions of the respective first and second conductive elements. At least some of the second conductive elements can overlie portions of corresponding ones of the first conductive elements and can be joined thereto. The microelectronic element can have contacts electrically connected with the bond pads of the lead frame.

摘要翻译： 微电子组件可以包括微电子元件和引线框架，引线框架具有覆盖第一单元并与其组装的第一单元和第二单元。 第一单元可以具有包括引线框架的厚度的一部分的第一金属层，并且包括端子和从其延伸的第一导电元件。 第二单元可以具有包括引线框架的厚度的一部分的第二金属层，并且包括接合焊盘和从其延伸的第二导电元件。 第一和第二单元各自可以具有支撑相应的第一和第二导电元件的至少一部分的封装。 至少一些第二导电元件可以覆盖相应的第一导电元件的部分并且可以与其连接。 微电子元件可以具有与引线框架的接合焊盘电连接的触点。

公开(公告)号：US20130202255A1

公开(公告)日：2013-08-08

申请号：US13755843

申请日：2013-01-31

申请人： Chris Kiyoshi Togami ,  Soham Pathak ,  Kalpendu Shastri ,  Kishor Desai ,  Ravinder Kachru ,  Bipin Dama ,  Vipulkumar Patel

发明人： Chris Kiyoshi Togami ,  Soham Pathak ,  Kalpendu Shastri ,  Kishor Desai ,  Ravinder Kachru ,  Bipin Dama ,  Vipulkumar Patel

IPC分类号： G02B6/42 ,  G02B6/43

CPC分类号： G02B6/421 ,  G02B6/3885 ,  G02B6/4204 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4292 ,  G02B6/43

摘要： An apparatus for providing single mode optical signal coupling between an opto-electronic transceiver and a single mode optical fiber array takes the form of a lens array and a ferrule component. The lens array includes a plurality of separate lens element disposed to intercept a like plurality of single mode optical output signal from the opto-electronic transceiver and provide as an output a focused version thereof. The ferrule component includes a plurality of single mode fiber stubs that are passively aligned with the lens array and support the transmission of the focused, single mode optical output signals towards the associated single mode optical fiber array.

摘要翻译： 用于在光电收发器和单模光纤阵列之间提供单模光信号耦合的装置采用透镜阵列和套圈部件的形式。 透镜阵列包括多个单独的透镜元件，其设置成截取来自光电收发器的类似多个单模光输出信号，并提供其聚焦版本的输出。 套圈组件包括与透镜阵列无源对准的多个单模光纤短截线，并支持将聚焦的单模光输出信号传输到相关联的单模光纤阵列。

公开(公告)号：US20130188970A1

公开(公告)日：2013-07-25

申请号：US13745773

申请日：2013-01-19

申请人： Kalpendu Shastri ,  Vipulkumar Patel ,  Soham Pathak ,  Utpal Chakrabarti ,  Bipin Dama ,  Ravinder Kachru ,  Kishor Desai

发明人： Kalpendu Shastri ,  Vipulkumar Patel ,  Soham Pathak ,  Utpal Chakrabarti ,  Bipin Dama ,  Ravinder Kachru ,  Kishor Desai

IPC分类号： H04B10/12

CPC分类号： H04B10/501 ,  G02B6/3512 ,  G02B6/3692 ,  G02B6/4214 ,  G02B6/4256 ,  G02B6/4292 ,  Y10T29/49002

摘要： An apparatus for transmitting optical signals includes an interposer for supporting opto-electronic components used to create optical output signals. An enclosure is used to encapsulate the populated interposer assembly and includes a silicon sidewall and a transparent lid. The sidewall is etched to include a turning mirror feature with a reflecting surface at a predetermined angle θ, the turning mirror disposed to intercept the optical output signals and re-direct them through the enclosure's transparent lid. A coverplate is disposed over and aligned with the enclosure, where the coverplate includes a silicon sidewall member that is etched to include a turning mirror element with a reflecting surface at the same angle θ as the enclosure's turning mirror element. The optical signals re-directed by the enclosure then pass through the transparent lid of the enclosure, impinge the turning mirror element of the coverplate, and are then re-directed along the longitudinal axis.

摘要翻译： 用于发送光信号的装置包括用于支持用于产生光输出信号的光电组件的插入器。 外壳用于封装填充的插入器组件，并且包括硅侧壁和透明盖。 侧壁被蚀刻以包括具有预定角度θ的反射表面的转向镜特征，转向镜被设置成拦截光学输出信号并将其重新引导通过外壳的透明盖。 盖板设置在外壳上并与壳体对准，其中盖板包括硅侧壁构件，其被蚀刻以包括具有与外壳的转向镜元件相同角度θ的反射表面的转向镜元件。 由外壳重新引导的光学信号然后穿过外壳的透明盖，撞击盖板的转向镜元件，然后沿着纵向轴线重新定向。