发明授权
- 专利标题： Flip-chip QFN structure using etched lead frame
- 专利标题（中）： 使用蚀刻引线框的倒装QFN结构
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申请号： US13173883申请日： 2011-06-30
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公开(公告)号： US08525309B2公开(公告)日： 2013-09-03
- 发明人: Chok Chia , Qwai Low , Kishor Desai , Charles G. Woychik
- 申请人： Chok Chia , Qwai Low , Kishor Desai , Charles G. Woychik
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/50 ; H01L23/34 ; H01L21/60 ; H01R43/16
摘要：
A microelectronic unit can include a lead frame and a device chip. The lead frame can have a plurality of monolithic lead fingers extending in a plane of the lead frame. Each lead finger can have a fan-out portion and a chip connection portion extending in the lead frame plane. The fan-out portions can have first and second opposed surfaces and a first thickness in a first direction between the opposed surfaces. The chip connection portions can have a second thickness smaller than the first thickness. The chip connection portions can define a recess below the first surface. The device chip can have a plurality of at least one of passive devices or active devices. The device chip can have contacts thereon facing the chip connection portions and electrically coupled thereto. At least a portion of a thickness of the device chip can extend within the recess.
公开/授权文献
- US20130001757A1 FLIP-CHIP QFN STRUCTURE USING ETCHED LEAD FRAME 公开/授权日：2013-01-03
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