发明授权
- 专利标题： Method for manufacturing array substrate and array substrate, and method for manufacturing screen and screen
- 专利标题（中）： 阵列基板和阵列基板的制造方法以及屏幕和屏幕的制造方法
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申请号： US13445047申请日： 2012-04-12
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公开(公告)号： US08526107B2公开(公告)日： 2013-09-03
- 发明人: Atsushi Saito , Kazuo Aoki , Shintaro Yoshitome
- 申请人： Atsushi Saito , Kazuo Aoki , Shintaro Yoshitome
- 申请人地址： JP Tokyo
- 专利权人： Seiko Epson Corporation
- 当前专利权人： Seiko Epson Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： ALG Intellectual Property, LLC
- 优先权： JP2011-089832 20110414
- 主分类号： G03B21/56
- IPC分类号： G03B21/56
摘要：
A method for manufacturing an array substrate includes forming a plurality of holes in a film shape substrate having thermal plasticity, in which the holes have a diameter of 0.25 times to 2 times a thickness of the substrate, and a pitch of 5 times to 40 times the diameter of the holes; and heating a molding member provided with a plurality of convex portions or concave portions in an array pattern, pressing the substrate provided with the plurality of holes, and transferring the plurality of convex portions or concave portions to the substrate.
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