发明授权
US08530958B2 Semiconductor device having split gate type, non-volatile memory cells and a method of manufacturing the same
有权
具有分裂门型,非易失性存储单元的半导体器件及其制造方法
- 专利标题: Semiconductor device having split gate type, non-volatile memory cells and a method of manufacturing the same
- 专利标题(中): 具有分裂门型,非易失性存储单元的半导体器件及其制造方法
-
申请号: US12718002申请日: 2010-03-05
-
公开(公告)号: US08530958B2公开(公告)日: 2013-09-10
- 发明人: Koichi Toba , Yasushi Ishii , Yoshiyuki Kawashima , Satoru Machida , Munekatsu Nakagawa , Kentaro Saito , Toshikazu Matsui , Takashi Hashimoto , Kosuke Okuyama
- 申请人: Koichi Toba , Yasushi Ishii , Yoshiyuki Kawashima , Satoru Machida , Munekatsu Nakagawa , Kentaro Saito , Toshikazu Matsui , Takashi Hashimoto , Kosuke Okuyama
- 申请人地址: JP Kawasaki-shi
- 专利权人: Renesas Electronics Corporation
- 当前专利权人: Renesas Electronics Corporation
- 当前专利权人地址: JP Kawasaki-shi
- 代理机构: Miles & Stockbridge P.C.
- 优先权: JP2006-103463 20060404
- 主分类号: H01L29/792
- IPC分类号: H01L29/792
摘要:
A semiconductor device having a non-volatile memory is disclosed, whose disturb defect can be diminished or prevented. A memory cell of the non-volatile memory has a memory gate electrode formed over a main surface of a semiconductor substrate through an insulating film for charge storage. A first side wall is formed on a side face of the memory gate electrode, and at a side face of the first side wall, a second side wall is formed. On an upper surface of an n+-type semiconductor region for source in the memory cell there is formed a silicide layer whose end portion on the memory gate electrode MG side is defined by the second side wall.
公开/授权文献
信息查询
IPC分类: