发明授权
- 专利标题: High current high voltage GaN field effect transistors and method of fabricating same
- 专利标题(中): 大电流高压GaN场效应晶体管及其制造方法
-
申请号: US13312406申请日: 2011-12-06
-
公开(公告)号: US08530978B1公开(公告)日: 2013-09-10
- 发明人: Rongming Chu , Zijian “Ray” Li , Karim S. Boutros , Shawn Burnham
- 申请人: Rongming Chu , Zijian “Ray” Li , Karim S. Boutros , Shawn Burnham
- 申请人地址: US CA Malibu
- 专利权人: HRL Laboratories, LLC
- 当前专利权人: HRL Laboratories, LLC
- 当前专利权人地址: US CA Malibu
- 代理机构: Ladas & Parry
- 主分类号: H01L29/66
- IPC分类号: H01L29/66
摘要:
A field effect transistor (FET) having a source contact to a channel layer, a drain contact to the channel layer, and a gate contact on a barrier layer over the channel layer, the FET including a dielectric layer on the barrier layer between the source contact and the drain contact and over the gate contact, and a field plate on the dielectric layer, the field plate connected to the source contact and extending over a space between the gate contact and the drain contact and the field plate comprising a sloped sidewall in the space between the gate contact and the drain contact.