发明授权
US08530981B2 Leadframe-based premolded package having acoustic air channel for micro-electro-mechanical system
有权
基于引线框架的预制包装，具有用于微机电系统的声学空气通道
- 专利标题： Leadframe-based premolded package having acoustic air channel for micro-electro-mechanical system
- 专利标题（中）： 基于引线框架的预制包装，具有用于微机电系统的声学空气通道
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申请号： US12969821申请日： 2010-12-16
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公开(公告)号： US08530981B2公开(公告)日： 2013-09-10
- 发明人: James Richard Huckabee , Ray H. Purdom
- 申请人： James Richard Huckabee , Ray H. Purdom
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： US TX Dallas
- 代理商 Warren L. Franz; Wade J. Brady, III; Frederick J. Telecky, Jr.
- 主分类号： H01L29/66
- IPC分类号： H01L29/66 ; H01L21/02
摘要：
A low-cost microelectromechanical system (MEMS) device has a mass-produced carrier fabricated as a pre-molded leadframe so that the space of the leadframe center is filled with compound and a two-tier stepped recess is created in the center. The first tier is filled by an inset with a first perforation and a second perforation. An integrated circuit chip with an opening and a membrane at the end of the opening, operable as a pressure sensor, microphone, speaker, etc., is assembled on the inset so that the chip opening is aligned with the first perforation. The chip is protected by a cover transected by a vent aligned with the second inset perforation. An air channel extends from the ambient exterior through the vent and the second perforation to the second tier recess, which acts as a channel and connects to the first perforation and the chip opening to the membrane.
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