公开(公告)号：US08530981B2

公开(公告)日：2013-09-10

申请号：US12969821

申请日：2010-12-16

申请人： James Richard Huckabee ,  Ray H. Purdom

发明人： James Richard Huckabee ,  Ray H. Purdom

IPC分类号： H01L29/66 ,  H01L21/02

CPC分类号： B81C1/00261 ,  B81B3/0081 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2201/0264 ,  H01L2224/45144 ,  H01L2224/48465 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/00

摘要： A low-cost microelectromechanical system (MEMS) device has a mass-produced carrier fabricated as a pre-molded leadframe so that the space of the leadframe center is filled with compound and a two-tier stepped recess is created in the center. The first tier is filled by an inset with a first perforation and a second perforation. An integrated circuit chip with an opening and a membrane at the end of the opening, operable as a pressure sensor, microphone, speaker, etc., is assembled on the inset so that the chip opening is aligned with the first perforation. The chip is protected by a cover transected by a vent aligned with the second inset perforation. An air channel extends from the ambient exterior through the vent and the second perforation to the second tier recess, which acts as a channel and connects to the first perforation and the chip opening to the membrane.

摘要翻译： 低成本的微机电系统（MEMS）装置具有制造成预成型引线框架的质量生产的载体，使得引线框架中心的空间填充有复合物，并且在中心形成两层阶梯式凹槽。 第一层由具有第一穿孔和第二穿孔的插入物填充。 在开口端部具有可开启压力传感器，麦克风，扬声器等的开口和膜的集成电路芯片组装在插图上，使得芯片开口与第一穿孔对准。 芯片由与第二插入孔对准的通气孔横切的盖保护。 空气通道从环境外部通过排气口和第二穿孔延伸到第二层凹槽，其作为通道并连接到第一穿孔和到膜的开口。

公开(公告)号：US20110156176A1

公开(公告)日：2011-06-30

申请号：US12969821

申请日：2010-12-16

申请人： James Richard Huckabee ,  Ray H. Purdom

发明人： James Richard Huckabee ,  Ray H. Purdom

IPC分类号： H01L29/66 ,  H01L21/02

CPC分类号： B81C1/00261 ,  B81B3/0081 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2201/0264 ,  H01L2224/45144 ,  H01L2224/48465 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/00

摘要： A low-cost micro-electro-mechanical system (MEMS) has a mass-produced carrier fabricated as a pre-molded leadframe so that the space of the leadframe center is filled with compound and a two-tier recess is created in the center. The first tier is filled by an inset with a first perforation and a second perforation. An integrated circuit chip with an opening and a membrane at the end of the opening, operable as a pressure sensor, microphone, speaker, etc, is assembled on the inset so that the opening is aligned with the first perforation. The chip is protected by a cover transected by a vent aligned with the second inset perforation. An air channel can then reach from the ambient through the vent and the second perforation to the second tier recess, which connects to the first perforation and the chip opening to the membrane.

摘要翻译： 低成本的微机电系统（MEMS）具有作为预成型引线框制造的大量生产的载体，使得引线框架中心的空间填充有复合物，并且在中心形成两层凹槽。 第一层由具有第一穿孔和第二穿孔的插入物填充。 在开口端部的具有开口的膜和可操作为压力传感器，麦克风，扬声器等的膜的集成电路芯片组装在插图上，使得开口与第一穿孔对准。 芯片由与第二插入孔对准的通气孔横切的盖保护。 空气通道然后可以从环境通过排气口和第二穿孔到达第二层凹槽，其连接到第一穿孔和到膜的开口。