发明授权
- 专利标题： Material structure in scribe line and method of separating chips
- 专利标题（中）： 划线中的材料结构和分离芯片的方法
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申请号： US12952403申请日： 2010-11-23
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公开(公告)号： US08531008B2公开(公告)日： 2013-09-10
- 发明人: Thomas Fischer , Heinz Opolka
- 申请人： Thomas Fischer , Heinz Opolka
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/544
- IPC分类号： H01L23/544
摘要：
A method for manufacturing a chip is disclosed. The method comprises forming a material structure in a kerf adjacent the chip on a wafer. The method further comprises selectively removing the material structure in the kerf and dicing the wafer.A semiconductor wafer is disclosed. The semiconductor wafer comprises a plurality of chips and a plurality of kerfs. The kerfs separate the chips from each other. At least one kerf comprises a kerf framing. The kerf framing is arranged directly adjacent a side of the at least on chip.
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