Invention Grant
- Patent Title: Anti-shock method for head stack assembly
- Patent Title (中): 头堆组装抗震方法
-
Application No.: US13370421Application Date: 2012-02-10
-
Publication No.: US08531797B2Publication Date: 2013-09-10
- Inventor: Da peng Zhao , Xiong fei Wei , Bin Liu , Shengxiang Chen
- Applicant: Da peng Zhao , Xiong fei Wei , Bin Liu , Shengxiang Chen
- Applicant Address: CN Hong Kong
- Assignee: SAE Magnetics (H.K.) Ltd.
- Current Assignee: SAE Magnetics (H.K.) Ltd.
- Current Assignee Address: CN Hong Kong
- Agency: Nixon & Vanderhye PC
- Priority: CN201110452870 20111229
- Main IPC: G11B21/02
- IPC: G11B21/02 ; G11B5/48

Abstract:
The present invention directs an anti-shock method for head stack assembly which carries a slider for flying on a disk for operation, and the anti-shock method includes: inputting a constant current to a head disk interface sensor which is deposited in the slider; obtaining a changing voltage of the head disk interface sensor, which is changed with the temperature of the head disk interface sensor as the slider is shocked; outputting the changing voltage to a controller with a threshold set therein; if the changing voltage is bigger than the threshold for a specified number of times, the controller is triggered to control the head stack assembly to stop operating and load on a ramp beside the disk; while if the changing voltage is small than the threshold for said specified number of times, the controller is not be triggered and the head stack assembly still operates.
Public/Granted literature
- US20130170073A1 ANTI-SHOCK METHOD FOR HEAD STACK ASSEMBLY Public/Granted day:2013-07-04
Information query