Invention Grant
- Patent Title: Hybrid process for forming metal gates of MOS devices
- Patent Title (中): 用于形成MOS器件的金属栅极的混合工艺
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Application No.: US12047113Application Date: 2008-03-12
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Publication No.: US08536660B2Publication Date: 2013-09-17
- Inventor: Peng-Fu Hsu , Yong-Tian Hou , Ssu-Yi Li , Kuo-Tai Huang , Mong Song Liang
- Applicant: Peng-Fu Hsu , Yong-Tian Hou , Ssu-Yi Li , Kuo-Tai Huang , Mong Song Liang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
A semiconductor structure includes a first MOS device including a first gate, and a second MOS device including a second gate. The first gate includes a first high-k dielectric over a semiconductor substrate; a second high-k dielectric over the first high-k dielectric; a first metal layer over the second high-k dielectric, wherein the first metal layer dominates a work-function of the first MOS device; and a second metal layer over the first metal layer. The second gate includes a third high-k dielectric over the semiconductor substrate, wherein the first and the third high-k dielectrics are formed of same materials, and have substantially a same thickness; a third metal layer over the third high-k dielectric, wherein the third metal layer and the second metal layer are formed of same materials, and have substantially a same thickness; and a fourth metal layer over the third metal layer.
Public/Granted literature
- US20090230479A1 Hybrid Process for Forming Metal Gates of MOS Devices Public/Granted day:2009-09-17
Information query
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