发明授权
- 专利标题： Wiring board and power conversion device
- 专利标题（中）： 接线板和电源转换装置
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申请号： US13329423申请日： 2011-12-19
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公开(公告)号： US08537550B2公开(公告)日： 2013-09-17
- 发明人: Masato Higuchi , Yasuhiko Kawanami , Katsushi Terazono , Koji Higashikawa , Akira Sasaki , Takayuki Morihara , Takashi Aoki , Tetsuya Ito , Yukihisa Nakabayashi , Tasuku Isobe , Kiyonori Koguma
- 申请人： Masato Higuchi , Yasuhiko Kawanami , Katsushi Terazono , Koji Higashikawa , Akira Sasaki , Takayuki Morihara , Takashi Aoki , Tetsuya Ito , Yukihisa Nakabayashi , Tasuku Isobe , Kiyonori Koguma
- 申请人地址： JP Kitakyushu-Shi
- 专利权人： Kabushiki Kaisha Yaskawa Denki
- 当前专利权人： Kabushiki Kaisha Yaskawa Denki
- 当前专利权人地址： JP Kitakyushu-Shi
- 代理机构： Ditthavong Mori & Steiner, P.C.
- 优先权： JP2009-146954 20090619
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.
公开/授权文献
- US20120236500A1 WIRING BOARD AND POWER CONVERSION DEVICE 公开/授权日：2012-09-20
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