Invention Grant
- Patent Title: Holding apparatus
- Patent Title (中): 保持装置
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Application No.: US12418880Application Date: 2009-04-06
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Publication No.: US08537556B2Publication Date: 2013-09-17
- Inventor: Bernd Beyer , Horst Friesner , Markus Hemmerlein , Florian Hofmann , Helmut Repp , Wolfgang Schnitzerlein , Markus Stark , Peter Tichy
- Applicant: Bernd Beyer , Horst Friesner , Markus Hemmerlein , Florian Hofmann , Helmut Repp , Wolfgang Schnitzerlein , Markus Stark , Peter Tichy
- Applicant Address: DE München
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE München
- Agency: Lempia Summerfield Katz LLC
- Priority: DE102008018386 20080411
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K5/00 ; H05K7/10 ; H05K7/14 ; H05K1/11 ; H05K7/02
Abstract:
The invention specifies a holding apparatus comprising a support element and a circuit board. A trench for receiving the circuit board is embodied in the support element. At least one first clamping element is arranged on one or both longitudinal sides of the circuit board and/or at least one second clamping element is arranged in the trench. As a result, the circuit board received by the trench is fixed in the trench in a clearance-free fashion.
Public/Granted literature
- US20090257206A1 HOLDING APPARATUS Public/Granted day:2009-10-15
Information query
