发明授权
US08541800B2 Light emitting device package, backlight unit, display device and lighting device
有权
发光装置封装，背光单元，显示装置和照明装置
- 专利标题： Light emitting device package, backlight unit, display device and lighting device
- 专利标题（中）： 发光装置封装，背光单元，显示装置和照明装置
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申请号： US13140652申请日： 2009-12-21
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公开(公告)号： US08541800B2公开(公告)日： 2013-09-24
- 发明人: Seong Ah Joo , Hyo Jin Lee , Il Woo Park , Kyung Tae Kim
- 申请人： Seong Ah Joo , Hyo Jin Lee , Il Woo Park , Kyung Tae Kim
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： Sughrue Mion, PLLC
- 优先权： KR10-2008-0130053 20081219; KR10-2009-0127737 20091221
- 国际申请： PCT/KR2009/007644 WO 20091221
- 国际公布： WO2010/071386 WO 20100624
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
There is provided a light emitting device package including: a package body providing a chip mounting area and including first and second lead terminals; an LED chip mounted on the chip mounting area and electrically connected to the first and second lead terminals; a groove portion disposed around the LED chip in the chip mounting area; and a wavelength conversion portion formed of a resin containing a wavelength conversion material with which to enclose the LED chip and having an outer shape defined by the groove portion.