公开(公告)号：US20110249424A1

公开(公告)日：2011-10-13

申请号：US13140652

申请日：2009-12-21

申请人： Seong Ah Joo ,  Hyo Jin Lee ,  Il Woo Park ,  Kyung Tae Kim

发明人： Seong Ah Joo ,  Hyo Jin Lee ,  Il Woo Park ,  Kyung Tae Kim

IPC分类号： G09F13/04 ,  H01L33/50

CPC分类号： H01L33/50 ,  H01L33/486 ,  H01L33/505 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48257 ,  H01L2224/8592 ,  H01L2924/3025 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00

摘要： There is provided a light emitting device package including: a package body providing a chip mounting area and including first and second lead terminals; an LED chip mounted on the chip mounting area and electrically connected to the first and second lead terminals; a groove portion disposed around the LED chip in the chip mounting area; and a wavelength conversion portion formed of a resin containing a wavelength conversion material with which to enclose the LED chip and having an outer shape defined by the groove portion.

摘要翻译： 提供了一种发光器件封装，包括：封装体，其提供芯片安装区域并且包括第一和第二引线端子; LED芯片安装在芯片安装区域上并电连接到第一和第二引线端子; 设置在所述芯片安装区域中的所述LED芯片周围的槽部; 以及由包含波长转换材料的树脂形成的波长转换部分，用于封装LED芯片并具有由凹槽部分限定的外形。

公开(公告)号：US08541800B2

公开(公告)日：2013-09-24

申请号：US13140652

申请日：2009-12-21

申请人： Seong Ah Joo ,  Hyo Jin Lee ,  Il Woo Park ,  Kyung Tae Kim

发明人： Seong Ah Joo ,  Hyo Jin Lee ,  Il Woo Park ,  Kyung Tae Kim

IPC分类号： H01L33/00

CPC分类号： H01L33/50 ,  H01L33/486 ,  H01L33/505 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48257 ,  H01L2224/8592 ,  H01L2924/3025 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00

摘要： There is provided a light emitting device package including: a package body providing a chip mounting area and including first and second lead terminals; an LED chip mounted on the chip mounting area and electrically connected to the first and second lead terminals; a groove portion disposed around the LED chip in the chip mounting area; and a wavelength conversion portion formed of a resin containing a wavelength conversion material with which to enclose the LED chip and having an outer shape defined by the groove portion.

摘要翻译： 提供了一种发光器件封装，包括：封装体，其提供芯片安装区域并且包括第一和第二引线端子; LED芯片安装在芯片安装区域上并电连接到第一和第二引线端子; 设置在所述芯片安装区域中的所述LED芯片周围的槽部; 以及由包含波长转换材料的树脂形成的波长转换部分，用于封装LED芯片并具有由凹槽部分限定的外形。

公开(公告)号：US08507299B2

公开(公告)日：2013-08-13

申请号：US12785024

申请日：2010-05-21

申请人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  Il Woo Park

发明人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  Il Woo Park

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L33/486 ,  H01L33/56 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The present invention relates to a light emitting diode package and a manufacturing method thereof.The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.

摘要翻译： 本发明涉及发光二极管封装及其制造方法。 发光二极管封装包括基板，安装在基板的上部的LED芯片，涂覆在基板上部的模塑材料，其包括LED芯片的外表面，以及涂覆在基板的下部的密封剂 并且可以提高发光效率，最小化封装故障，并且通过促进制造工艺来降低制造成本。

公开(公告)号：US08445927B2

公开(公告)日：2013-05-21

申请号：US12360250

申请日：2009-01-27

申请人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  Il Woo Park

发明人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  Il Woo Park

IPC分类号： H01L21/50

CPC分类号： H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L33/486 ,  H01L33/56 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The present invention relates to a light emitting diode package and a manufacturing method thereof.The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.

公开(公告)号：US20110303940A1

公开(公告)日：2011-12-15

申请号：US13159120

申请日：2011-06-13

申请人： Hyo Jin LEE ,  Il Woo Park ,  Chang Hoon Kwak

发明人： Hyo Jin LEE ,  Il Woo Park ,  Chang Hoon Kwak

IPC分类号： H01L33/50 ,  H01L33/60

CPC分类号： H01L33/54 ,  F21V23/003 ,  F21V23/005 ,  H01L24/97 ,  H01L27/156 ,  H01L33/04 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/14 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： There is provided a light emitting device package using a quantum dot, an illumination apparatus and a display apparatus. The light emitting device package includes a light emitting device; a sealing part disposed in a path of light emitted from the light emitting device and having a lens shape; and a wavelength conversion part sealed within the sealing part and including a quantum dot. The light emitting device package uses the quantum dot as the wavelength conversion part to thereby achieve superior color reproducibility and light emission efficiency, and facilitates the control of color coordinates by adjusting the particle size and concentration of the quantum dot.

摘要翻译： 提供了使用量子点的发光器件封装，照明装置和显示装置。 发光器件封装包括发光器件; 密封部，其设置在从所述发光装置发射并具有透镜形状的光的路径中; 以及密封在所述密封部内并且包括量子点的波长转换部。 发光器件封装使用量子点作为波长转换部，从而实现优异的色彩再现性和发光效率，并且通过调整量子点的粒径和浓度来促进色坐标的控制。

公开(公告)号：US09087968B2

公开(公告)日：2015-07-21

申请号：US13458614

申请日：2012-04-27

申请人： Hyo Jin Lee ,  Jeong Hee Kim ,  Il Woo Park ,  Chang Hoon Kwak ,  Kyung Seo

发明人： Hyo Jin Lee ,  Jeong Hee Kim ,  Il Woo Park ,  Chang Hoon Kwak ,  Kyung Seo

IPC分类号： H05B37/00 ,  H01L33/50 ,  H01L33/00 ,  C09K11/08 ,  C09K11/77 ,  H05B33/14

CPC分类号： H01L33/504 ,  C09K11/0883 ,  C09K11/7734 ,  H01L33/0095 ,  H01L33/502 ,  H05B33/14 ,  Y02B20/181

摘要： There is provided a white light emitting device including: a blue LED emitting blue light; a red phosphor excited by the blue light, emitting red light, and including a nitrogen (N)-containing compound; a yellow phosphor excited by the blue light and emitting yellow light; a first green phosphor excited by the blue light, emitting first green light having a first full width half maximum, and including a nitrogen (N)-containing compound; and a second green phosphor excited by the blue light and emitting second green light having a second full width half maximum larger than the first full width half maximum of the first green phosphor.

摘要翻译： 提供了一种白光发射装置，包括：发蓝光的蓝色LED; 由蓝光激发的红色荧光体，发出红色光，并含有含氮（N）的化合物; 由蓝光激发的黄色荧光体发出黄光; 由蓝色光激发的第一绿色荧光体，发射具有第一全宽半最大值的第一绿色光，并且包括含氮（N）的化合物; 以及由蓝色光激发的第二绿色荧光体，并且发射具有大于第一绿色荧光体的第一全宽度半值的第二全宽度半值的第二绿色光。

公开(公告)号：US20140158982A1

公开(公告)日：2014-06-12

申请号：US14237036

申请日：2012-08-02

申请人： Il Woo Park ,  Hyo Jin Lee ,  Jeong Hee Kim ,  Na Ree Woo ,  Chang Bun Yoon ,  Chul Soo Yoon

发明人： Il Woo Park ,  Hyo Jin Lee ,  Jeong Hee Kim ,  Na Ree Woo ,  Chang Bun Yoon ,  Chul Soo Yoon

IPC分类号： H01L33/06 ,  H01L33/50

CPC分类号： H01L33/06 ,  G02B6/005 ,  G02F1/133603 ,  G02F2001/133614 ,  H01L33/50 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting device may include: a light emitting unit; a wavelength conversion unit disposed in a path of light emitted from the light emitting unit and converting a wavelength of light emitted from the light emitting unit; and a light transmission unit formed on at least one side of the wavelength conversion unit. The wavelength conversion unit may include a first quantum dot converting a wavelength of light into red light and a second quantum dot converting a wavelength of light into green light, and the patterns of first quantum dot and second quantum dot are alternately disposed repeatedly at least one or more times.

摘要翻译： 发光装置可以包括：发光单元; 波长转换单元，设置在从所述发光单元发射的光的路径中并转换从所述发光单元发射的光的波长; 以及形成在所述波长转换单元的至少一侧的光传输单元。 波长转换单元可以包括将光的波长转换为红光的第一量子点和将波长的光转换成绿色光的第二量子点，并且第一量子点和第二量子点的图案重复交替设置至少一个 或更多次。

公开(公告)号：US20130149508A1

公开(公告)日：2013-06-13

申请号：US13818373

申请日：2011-08-24

申请人： Chang Hoon Kwak ,  Il Woo Park ,  Kyu Jin Lee ,  Cheol Jun Yoo ,  Seong Jae Hong

发明人： Chang Hoon Kwak ,  Il Woo Park ,  Kyu Jin Lee ,  Cheol Jun Yoo ,  Seong Jae Hong

IPC分类号： H01L33/50

CPC分类号： H01L33/50 ,  B32B3/08 ,  B32B3/10 ,  B32B3/14 ,  B32B3/16 ,  B32B3/18 ,  B32B5/16 ,  B32B7/12 ,  B32B9/04 ,  B32B9/045 ,  B32B27/06 ,  B32B27/08 ,  B32B27/32 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2250/44 ,  B32B2266/025 ,  B32B2307/40 ,  B32B2307/422 ,  B32B2457/00 ,  C09K11/06 ,  H01L24/97 ,  H01L33/505 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/181 ,  H01L2933/0041 ,  H05B33/22 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24893 ,  Y10T428/24942 ,  Y10T428/31855 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01005 ,  H01L2924/00012

摘要： There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.

摘要翻译： 提供了荧光体膜，其制造方法以及涂覆荧光体层的LED芯片的方法。 荧光体膜包括：基膜; 通过将部分固化的树脂材料中的荧光体粒子混合而形成在基底膜上的荧光体层; 以及形成在荧光体层上以保护荧光体层的覆盖膜。

公开(公告)号：US20110266584A1

公开(公告)日：2011-11-03

申请号：US13183176

申请日：2011-07-14

申请人： Jong Rak SOHN ,  Chul Soo Yoon ,  Chang Hoon Kwak ,  Il Woo Park

发明人： Jong Rak SOHN ,  Chul Soo Yoon ,  Chang Hoon Kwak ,  Il Woo Park

IPC分类号： H01L33/50

CPC分类号： C09K11/7792 ,  C09K11/0883 ,  C09K11/7786 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05B33/14 ,  Y02B20/181 ,  H01L2924/00014

摘要： Provided is a white light emitting diode (LED) including a blue LED chip; and yellow, green, and red light emitting phosphors that are coated on the blue LED chip at a predetermined mixing ratio and converts light, emitted from the blue LED chip, into white light.

摘要翻译： 提供了包括蓝色LED芯片的白色发光二极管（LED） 以及以预定混合比涂覆在蓝色LED芯片上的黄色，绿色和红色发光荧光体，并将从蓝色LED芯片发出的光转换成白色光。

公开(公告)号：US20110007228A1

公开(公告)日：2011-01-13

申请号：US12884759

申请日：2010-09-17

申请人： Chul Soo Yoon ,  Jong Rak Sohn ,  Il Woo Park

发明人： Chul Soo Yoon ,  Jong Rak Sohn ,  Il Woo Park

IPC分类号： H04N5/66 ,  G02F1/13357 ,  H01L33/44 ,  G02F1/1335 ,  G09G3/36 ,  G09G5/10

CPC分类号： C09K11/7731 ,  C09K11/0838 ,  C09K11/584 ,  C09K11/7721 ,  C09K11/7734 ,  C09K11/7774 ,  H01L33/502 ,  H01L33/504 ,  H01L2224/48091 ,  Y02B20/181 ,  H01L2924/00014

摘要： A white light emitting device capable of expanding the wavelength range of a blue LED used for realizing white light. The white light emitting device according to the present invention includes a blue LED and a mixture of orange phosphor and green phosphor disposed above the blue LED.

摘要翻译： 一种能够扩大用于实现白光的蓝色LED的波长范围的白色发光装置。 根据本发明的白色发光器件包括蓝色LED和布置在蓝色LED上方的橙色荧光体和绿色荧光体的混合物。