Invention Grant
- Patent Title: Structure and method for semiconductor power devices
- Patent Title (中): 半导体功率器件的结构和方法
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Application No.: US13028054Application Date: 2011-02-15
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Publication No.: US08541840B2Publication Date: 2013-09-24
- Inventor: James Pan
- Applicant: James Pan
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Main IPC: H01L27/12
- IPC: H01L27/12

Abstract:
A semiconductor device includes a semiconductor-on-insulator region on a substrate. The semiconductor-on-insulator region includes a first semiconductor region overlying a dielectric region. The device includes an MOS transistor and a bipolar transistor. The MOS transistor has a drain region, a body region, and a source region in the first semiconductor region. The MOS transistor also includes a gate. The device also includes a second semiconductor region overlying the substrate and adjacent to the drain region, and a third semiconductor region overlying the substrate and adjacent to the second semiconductor region. The bipolar transistor includes has the drain region of the MOS transistor as an emitter, the second semiconductor region as a base, and the third semiconductor region as a collector. Accordingly, the drain of the MOS transistor also functions as the emitter of the bipolar transistor. Additionally, the gate and the base are coupled by a resistive element.
Public/Granted literature
- US20110133275A1 STRUCTURE AND METHOD FOR SEMICONDUCTOR POWER DEVICES Public/Granted day:2011-06-09
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