发明授权
- 专利标题: Electrodeposited metallic materials comprising cobalt
- 专利标题(中): 包含钴的电沉积金属材料
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申请号: US12785520申请日: 2010-05-24
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公开(公告)号: US08545994B2公开(公告)日: 2013-10-01
- 发明人: Diana Facchini , Francisco Gonzalez , Jonathan McCrea , Mike Uetz , Gino Palumbo , Klaus Tomantschger , Nandakumar Nagarajan , Jared J. Victor , Uwe Erb
- 申请人: Diana Facchini , Francisco Gonzalez , Jonathan McCrea , Mike Uetz , Gino Palumbo , Klaus Tomantschger , Nandakumar Nagarajan , Jared J. Victor , Uwe Erb
- 申请人地址: CA Ontario
- 专利权人: Integran Technologies Inc.
- 当前专利权人: Integran Technologies Inc.
- 当前专利权人地址: CA Ontario
- 代理机构: Rankin Hill & Clark LLP
- 主分类号: B32B3/02
- IPC分类号: B32B3/02 ; B32B15/04 ; C22C19/07 ; C25D5/48 ; C25D3/12
摘要:
An article includes an electrodeposited metallic material including Co with a minimum content of 75% by weight. The metallic material has a microstructure which is fine-grained with an average grain size between 2 and 5,000 nm and/or an amorphous microstructure. The metallic material forms at least part of an exposed surface of the article. The metallic material has an inherent contact angle for water of less than 90 degrees at room temperature when measured on a smooth exposed surface portion of the metallic material which has a maximum surface roughness Ra of 0.25 microns. The metallic material has an exposed patterned surface portion having surface structures having a height of between at least 5 microns to about 100 microns incorporated therein to increase the contact angle for water at room temperature of the exposed patterned surface portion to over 100 degrees.
公开/授权文献
- US20100304179A1 ELECTRODEPOSITED METALLIC MATERIALS COMPRISING COBALT 公开/授权日:2010-12-02