Invention Grant
- Patent Title: Method for positioning chips during the production of a reconstituted wafer
- Patent Title (中): 在制造重构晶片期间定位芯片的方法
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Application No.: US13255874Application Date: 2010-03-09
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Publication No.: US08546190B2Publication Date: 2013-10-01
- Inventor: Christian Val
- Applicant: Christian Val
- Applicant Address: FR Buc Cedex
- Assignee: 3D Plus
- Current Assignee: 3D Plus
- Current Assignee Address: FR Buc Cedex
- Agency: Baker & Hostetler LLP
- Priority: FR0901095 20090310
- International Application: PCT/EP2010/052964 WO 20100309
- International Announcement: WO2010/102996 WO 20100916
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A process for fabricating a reconstituted wafer that includes chips having connection pads on a front side of the chip, this process including positioning of the chips on an adhesive support, front side down on the support; deposition of a resin on the support in order to encapsulate the chips; and curing of the resin. Before deposition of the resin, the process includes bonding, onto the chips, a support wafer for positioning the chips, this support wafer having parts placed on one side of the chips.
Public/Granted literature
- US20110312132A1 METHOD FOR POSITIONING CHIPS DURING THE PRODUCTION OF A RECONSTITUTED WAFER Public/Granted day:2011-12-22
Information query
IPC分类:
