Invention Grant
- Patent Title: Mechanical layer and methods of shaping the same
- Patent Title (中): 机械层及其成型方法
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Application No.: US12731583Application Date: 2010-03-25
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Publication No.: US08547626B2Publication Date: 2013-10-01
- Inventor: Yi Tao , Fan Zhong , Teruo Sasagawa
- Applicant: Yi Tao , Fan Zhong , Teruo Sasagawa
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Knobbe, Martens Olson & Bear, LLP
- Main IPC: G02B26/00
- IPC: G02B26/00

Abstract:
A method of shaping a mechanical layer is disclosed. In one embodiment, the method comprises depositing a support layer, a sacrificial layer and a mechanical layer over a substrate, and forming a support post from the support layer. A kink is formed adjacent to the support post in the mechanical layer. The kink comprises a rising edge and a falling edge, and the kink can be configured to control the shaping and curvature of the mechanical layer upon removal of the sacrificial layer.
Public/Granted literature
- US20110235155A1 MECHANICAL LAYER AND METHODS OF SHAPING THE SAME Public/Granted day:2011-09-29
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