发明授权
- 专利标题: Mechanical layer and methods of shaping the same
- 专利标题(中): 机械层及其成型方法
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申请号: US12731583申请日: 2010-03-25
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公开(公告)号: US08547626B2公开(公告)日: 2013-10-01
- 发明人: Yi Tao , Fan Zhong , Teruo Sasagawa
- 申请人: Yi Tao , Fan Zhong , Teruo Sasagawa
- 申请人地址: US CA San Diego
- 专利权人: QUALCOMM MEMS Technologies, Inc.
- 当前专利权人: QUALCOMM MEMS Technologies, Inc.
- 当前专利权人地址: US CA San Diego
- 代理机构: Knobbe, Martens Olson & Bear, LLP
- 主分类号: G02B26/00
- IPC分类号: G02B26/00
摘要:
A method of shaping a mechanical layer is disclosed. In one embodiment, the method comprises depositing a support layer, a sacrificial layer and a mechanical layer over a substrate, and forming a support post from the support layer. A kink is formed adjacent to the support post in the mechanical layer. The kink comprises a rising edge and a falling edge, and the kink can be configured to control the shaping and curvature of the mechanical layer upon removal of the sacrificial layer.
公开/授权文献
- US20110235155A1 MECHANICAL LAYER AND METHODS OF SHAPING THE SAME 公开/授权日:2011-09-29