Invention Grant
- Patent Title: Method of making microneedles
- Patent Title (中): 制造微针的方法
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Application No.: US11050116Application Date: 2005-02-03
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Publication No.: US08551391B2Publication Date: 2013-10-08
- Inventor: Eng-Pi Chang , Philip Yi Zhi Chu , Hsiao Ken Chuang , Kejian (Kevin) Huang , Michael Lang , Reza Mehrabi , Ronald F. Sieloff , Karen L. Spilizewski , Mark Wisniewski
- Applicant: Eng-Pi Chang , Philip Yi Zhi Chu , Hsiao Ken Chuang , Kejian (Kevin) Huang , Michael Lang , Reza Mehrabi , Ronald F. Sieloff , Karen L. Spilizewski , Mark Wisniewski
- Applicant Address: US CA Pasadena
- Assignee: Avery Dennison Corporation
- Current Assignee: Avery Dennison Corporation
- Current Assignee Address: US CA Pasadena
- Agency: Avery Dennison Corporation
- Main IPC: H05B1/02
- IPC: H05B1/02
Abstract:
A method of making a microneedle array structure (20) comprising a plurality of simultaneously formed microneedles (24), each microneedle (24) having a protrusion (32) and a passageway (34) extending therethrough. The method comprises the steps of pressing an embossable sheet material between a complimentary tools and radiantly heating the sheet material using radiant energy from a radiant energy source. One tool is relatively-radiantly-transparent, and another tool and/or the sheet material is relatively-radiantly-absorptive.
Public/Granted literature
- US20050178760A1 Method of making microneedles Public/Granted day:2005-08-18
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