摘要:
A method of making a microneedle array structure (20) comprising a plurality of simultaneously formed microneedles (24), each microneedle (24) having a protrusion (32) and a passageway (34) extending therethrough. The method comprises the steps of pressing an embossable sheet material between a complimentary tools and radiantly heating the sheet material using radiant energy from a radiant energy source. One tool is relatively-radiantly-transparent, and another tool and/or the sheet material is relatively-radiantly-absorptive.
摘要:
A method of embossing a sheet material includes: heating at least a portion of the sheet directly or indirectly with radiant energy from a radiant energy source; pressing a tool against the heated portion of the sheet, thereby patterning a surface of the sheet; and separating the sheet and the tool. The radiant energy may travel through a solid material that is relatively transparent to radiation, on its way to being absorbed by a relatively-absorptive material. The relatively-transparent material may be an unheated portion of the sheet, and the relatively-absorptive material may be either the tool or the heated portion of the sheet. Alternatively, the relatively-transparent material may be the tool, and the relatively-absorptive material may be all or part of the sheet. The method may be performed as one or more roll-to-roll operations.
摘要:
PSAs and PSA constructions, such as self-adhesive labels, are provided, and exhibit good slittability and reduced adhesive build-up in printers, including laser printers. In one embodiment, a PSA has a storage modulus at 1000 radians/s and 25° C. of about 5×106 dyne/cm2 or higher and a creep at 90° C. of about 125 or less. In one embodiment, the PSA is the polymerization product of a plurality of acrylic and other monomers.
摘要翻译:提供PSA和PSA结构,例如自粘标签,并且在包括激光打印机在内的打印机中表现出良好的切割性和减少的粘合剂积聚。 在一个实施方案中,PSA具有约10×10 6达因/ cm 2或更高的1000弧度/秒和25℃的储能模量,并且在90℃下的蠕变为约125或更小。 在一个实施方案中,PSA是多种丙烯酸和其它单体的聚合产物。
摘要:
An adhesive composition comprising: (i) a one part curable epoxy adhesive and (ii) a low profile additive (LPA), the low profile additive being a polymer that is compatible with the epoxy adhesive such that it forms a single phase when admixed with the adhesive composition and that separates from the adhesive to form a network of stress-absorbing nodules therein when the adhesive is cured, the low profile additive being present in an amount sufficient to prevent or reduce shrinkage and/or the formation of voids or cracks when the adhesive is cured. In one embodiment the LPA is a block copolymer including at least one flexible block and at least one rigid block that makes the low profile additive compatible with the epoxy adhesive such that a mixture of the uncured epoxy resin and the low profile additive forms a homogenous solution and as the epoxy resin is cured, the low profile additive forms a stress absorbing network of nodules in the cured epoxy resin matrix.