发明授权
US08551819B2 Method for surface mounting using cleaning-free activated resinous composition
有权
使用无清洁活性树脂组合物进行表面贴装的方法
- 专利标题： Method for surface mounting using cleaning-free activated resinous composition
- 专利标题（中）： 使用无清洁活性树脂组合物进行表面贴装的方法
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申请号： US13335015申请日： 2011-12-22
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公开(公告)号： US08551819B2公开(公告)日： 2013-10-08
- 发明人: Kazunori Kitamura , Yasuhiro Takase
- 申请人： Kazunori Kitamura , Yasuhiro Takase
- 申请人地址： JP Tokyo
- 专利权人： San-Ei Kagaku Co., Ltd.
- 当前专利权人： San-Ei Kagaku Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Clark & Brody
- 优先权： JP2009-196015 20090805; JP2010-056668 20100223
- 主分类号： H01L21/58
- IPC分类号： H01L21/58 ; C08L63/00 ; C09J163/00
摘要：
Activated resinous composition contains, on the basis of epoxy resin being solid at a room temperature of 100 parts by weight, carboxylic acid compound of 1 to 10 parts by weight, hardening agent of 1 to 30 parts by weight, a hardening reaction initiation temperature of said hardening agent being 150° C. or higher, and solvent of 10 to 300 parts by weight.
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